SMT20T15AHAF product image

Product Detail

SMT20T15AHAF

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
200 V
RDS(ON)_Max @VGS=10V
15.7 mΩ
RDS(ON)_Typ @VGS=10V
13.4 mΩ
VGS(th)_Typ
3.4 V
With ESD
No
Die Size (μm×μm)
5600*3900
Gross Die (8" wafer)
1266
Wafer Thickness (μm)
200±20
VGS_Max
±20 V
Ciss_Typ
2050 pF
Coss_Typ
297 pF
Crss_Typ
11 pF
Qg_Typ
31 nC
Qgs_Typ
9.8 nC
Qgd_Typ
7.7 nC
Tj
175 °C
Manufacturer Remarks
SGT N