Product Detail
SMT10T02BHAF
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 100 V
- RDS(ON)_Max @VGS=10V
- 2.4 mΩ
- RDS(ON)_Typ @VGS=10V
- 2 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (mm²)
- 4600*4100
- Gross Die (8" wafer)
- 1456
- Wafer Thickness (mm)
- 200±20
- VGS_Max
- ±20 V
- Ciss_Typ
- 6848 pF
- Coss_Typ
- 1416 pF
- Crss_Typ
- 49 pF
- Qg_Typ
- 91 nC
- Qgs_Typ
- 25 nC
- Qgd_Typ
- 18 nC