Product Detail
SMT10T01FHAF2
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 100 V
- RDS(ON)_Max @VGS=10V
- 1.25 mΩ
- RDS(ON)_Typ @VGS=10V
- 1 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (mm²)
- 6600*5050
- Gross Die (8" wafer)
- 805
- Wafer Thickness (mm)
- 200±20
- VGS_Max
- ±20 V
- Ciss_Typ
- 16992 pF
- Coss_Typ
- 4300 pF
- Crss_Typ
- 119 pF
- Qg_Typ
- 207 nC
- Qgs_Typ
- 78 nC
- Qgd_Typ
- 33 nC