Specifications
- Package
- PDFN5060-8L
- Configuration
- P
- VDS_Max
- -40 V
- ID
- -81 A
- RDS(ON)_Max @VGS=10V
- 8.3 mΩ
- Automotive (Y/N)
- Y
- VGS(th)_Typ
- -1.8 V
- RDS(ON)_Typ @VGS=10V
- 7 mΩ
- RDS(ON)_Typ @VGS=4.5V
- 10.3 mΩ
- RDS(ON)_Max @VGS=4.5V
- 13.4 mΩ
- VGS_Max
- ±20 V
- Tj
- 175 °C
- EAS_Max
- 212 mJ
- Ciss_Typ
- 1511 pF
- Coss_Typ
- 1077 pF
- Crss_Typ
- 70 pF
- Qg_Typ
- 24 nC
- ESD
- No
- MPQ
- 5000 pcs
- MOQ
- 50000 pcs
- App: Motor Drive
- Y
- App: HF Power
- Y
- App: General Switch
- Y
Not sure how to choose? Read the LV & MV MOSFETs Selection Guide →
Package & Schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SMP4008ALPQ
-40V P-Channel Enhancement Mode Power MOSFET
Sinesemi Automotive MOSFET — AEC-Q101 Qualified, PPAP Capable, 175°C Operating Temperature
Product Summary
| VDS |
RDS(ON), max |
ID, max |
| -40 V |
8.3 mΩ @ VGS = -10V |
-81 A |
|
13.4 mΩ @ VGS = -4.5V |
|
PDFN5060-8L
Features
- P-Channel Enhancement Mode - Logic Level
- AEC-Q101 Qualified, PPAP Capable
- 175°C Operating Temperature
- 100% ΔVDS & UIS & Rg Tested
Application
- General Automotive Applications
Ordering Information
| Orderable Part Number |
Package Type |
Device Marking |
Form |
Quantity (pcs) |
| SMP4008ALPQ PDFN5060-8L P4008ALQ 13'' Tape&Reel 5,000 |
— |
— |
— |
— |
Maximum Ratings (@ TC = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Value |
Unit |
| Drain - Source Voltage |
VDS |
-40 |
V |
| Gate - Source Voltage |
VGS |
±20 |
V |
| Continuous Drain Current (VGS = -10V) (1) |
ID |
TC = 25°C: -81 |
A |
|
|
TC = 100°C: -57 |
A |
| Pulsed Drain Current (2) |
IDM |
-324 |
A |
| Single Pulse Avalanche Energy (3) |
EAS |
212 |
mJ |
| Single Pulse Avalanche Current (L = 0.1mH) |
IAS |
-35 |
A |
| Power Dissipation |
PD |
TC = 25°C: 88 |
W |
|
|
TC = 100°C: 44 |
W |
| Junction & Storage Temperature Range |
TJ, TSTG |
-55 ~ +175 |
°C |
Thermal Characteristics
| Parameter |
Symbol |
Typ |
Max |
Unit |
| Thermal Resistance, Junction-to-Ambient (4) |
R_θJA |
37 |
46 |
°C/W |
| Thermal Resistance, Junction-to-Case (5) |
R_θJC |
1.3 |
1.7 |
°C/W |
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
Off Characteristics (6)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Drain-Source Breakdown Voltage |
V(BR)DSS |
VGS = 0V, ID = -250µA |
-40 |
— |
— |
V |
| Zero Gate Voltage Drain Current |
IDSS |
VDS = -40V, VGS = 0V |
— |
— |
-1.0 |
µA |
|
|
TJ = 125°C |
— |
— |
-100 |
µA |
| Gate-Source Leakage Current |
IGSS |
VGS = ±20V, VDS = 0V |
— |
— |
±100 |
nA |
On Characteristics (6)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Gate Threshold Voltage |
VGS(th) |
VDS = VGS, ID = -250µA |
-1.2 |
-1.8 |
-2.5 |
V |
| Static Drain-Source On-Resistance |
RDS(on) |
VGS = -10V, ID = -20A |
— |
7.0 |
8.3 |
mΩ |
|
|
VGS = -4.5V, ID = -15A |
— |
10.3 |
13.4 |
mΩ |
| Forward Transconductance |
gfs |
VDS = -5.0V, ID = -20A |
— |
30 |
— |
S |
| Diodes Forward Voltage |
VSD |
IS = -2.0A, VGS = 0V |
— |
-0.7 |
-1.2 |
V |
Dynamic Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Input Capacitance |
Ciss |
VDS = -20V, VGS = 0V, f = 1MHz |
— |
1511 |
1964 |
pF |
| Output Capacitance |
Coss |
|
— |
1077 |
1400 |
pF |
| Reverse Transfer Capacitance |
Crss |
|
— |
70 |
140 |
pF |
| Gate Resistance |
Rg |
VGS = 0V, VDS = 0V, f = 1MHz |
— |
12 |
— |
Ω |
Switching Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Turn-On Delay Time |
td(on) |
VGS = -10V, VDS = -20V |
— |
5.6 |
— |
ns |
| Rise Time |
tr |
ID = -20A, RGEN = 3.0Ω |
— |
13 |
— |
ns |
| Turn-Off Delay Time |
td(off) |
|
— |
47 |
— |
ns |
| Fall Time |
tf |
|
— |
26 |
— |
ns |
Gate Charge Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Total Gate Charge (VGS = -10V) |
Qg |
VDS = -20V, ID = -20A |
— |
24 |
31 |
nC |
| Total Gate Charge (VGS = -4.5V) |
Qg |
|
— |
11.8 |
15.3 |
nC |
| Gate-Source Charge |
Qgs |
VGS = -10V |
— |
4.4 |
6.6 |
nC |
| Gate-Drain Charge |
Qgd |
|
— |
3.8 |
5.7 |
nC |
| Gate Plateau Voltage |
Vplateau |
|
— |
-3.1 |
— |
V |
Drain-Source Diode Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Body Diode Reverse Recovery Time |
trr |
IS = -20A, di/dt = 100A/µs |
— |
38 |
— |
ns |
| Body Diode Reverse Recovery Charge |
Qrr |
TJ = 25°C |
— |
25 |
— |
nC |
| Diode Forward Current |
IS |
TC = 25°C |
— |
— |
-81 |
A |
Notes:
- This current is chip limited, which is calculated based on RθJC.
- This current is calculated on single pulse with 10µs Pulse.
- Defined by design, not subject to production test.
- Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
- Thermal resistance from junction to the exposed pad.
- Short duration pulse test used to minimize self-heating effect.
- Defined by design, not subject to production.
