Specifications
- Package
- Easy3b+BP
- VCE_Max
- 1200 V
- IC_Max
- 600 A
- VCE(sat)_Typ
- 1.8 V
- Status
- MP
- Qualification
- Industrial
- Configuration
- 3-Level
- Tj
- 175 °C
- VF_Typ
- 1.9 V
Not sure how to choose? Read the IGBT Modules Selection Guide →
Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SS120N060FTC
1200 V / 600 A 3-Level NPC2 Inverter Module
Features
- Neutral Point Clamped Three-Level Inverter Module
- Low Inductive Layout
- Solderable Pins
Benefits
- Higher System Efficiency
- Reduced Cooling Requirements
- Low Conduction Losses Over Temperature
Applications
- Solar Inverters
- Uninterruptable Power Supplies Systems
Package: Easy3b+BP
Absolute Maximum Ratings (@ TA = 25°C)
| Parameter |
Symbol |
Value |
Unit |
| IGBT (Q1, Q4) |
|
|
|
| Collector-Emitter Voltage |
VCES |
1200 |
V |
| Gate-Emitter Voltage |
VGE |
±25 |
V |
| Positive Transient Gate-Emitter Voltage (Tpulse = 5 s, D < 0.10) |
|
30 |
V |
| Continuous Collector Current |
IC |
600 |
A |
| Pulsed Collector Current |
ICP |
1200 |
A |
| IGBT (Q2, Q3) |
|
|
|
| Collector-Emitter Voltage |
VCES |
700 |
V |
| Gate-Emitter Voltage |
VGE |
±25 |
V |
| Positive Transient Gate-Emitter Voltage (Tpulse = 5 s, D < 0.10) |
|
30 |
V |
| Continuous Collector Current |
IC |
400 |
A |
| Pulsed Collector Current |
ICP |
800 |
A |
| DIODE (D1) |
|
|
|
| Peak Repetitive Reverse Voltage |
VRRM |
1200 |
V |
| Continuous Forward Current |
IF |
300 |
A |
| Repetitive Peak Forward Current |
IFRM |
600 |
A |
| DIODE (D4) |
|
|
|
| Peak Repetitive Reverse Voltage |
VRRM |
1200 |
V |
| Continuous Forward Current |
IF |
400 |
A |
| Repetitive Peak Forward Current |
IFRM |
800 |
A |
| DIODE (D2, D3) |
|
|
|
| Peak Repetitive Reverse Voltage |
VRRM |
700 |
V |
| Continuous Forward Current |
IF |
100 |
A |
| Repetitive Peak Forward Current |
IFRM |
200 |
A |
| DIODE (D5, D6) |
|
|
|
| Peak Repetitive Reverse Voltage |
VRRM |
700 |
V |
| Continuous Forward Current |
IF |
500 |
A |
| Repetitive Peak Forward Current |
IFRM |
1000 |
A |
| Insulation |
|
|
|
| Isolation Test Voltage, t = 1 min, 50 Hz |
Viso |
4000 |
VRMS |
| Temperature |
|
|
|
| Storage Temperature |
Tstg |
-40 to +125 |
°C |
| Operating Temperature |
Tvjop |
-40 to +150 |
°C |
| Junction Temperature |
Tj |
-40 to +175 |
°C |
Electrical Characteristics (@ Tj = 25°C, unless otherwise specified.)
IGBT (Q1, Q4)
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Collector-Emitter Saturation Voltage |
VCE(sat) (terminal) |
VGE = 15 V, IC = 600 A, Tj = -40°C |
— |
1.66 |
— |
V |
|
|
Tj = 25°C |
— |
1.82 |
— |
V |
|
|
Tj = 150°C |
— |
2.30 |
— |
V |
| Gate-Emitter Threshold Voltage |
VGE(TH) |
VGE = VCE, IC = 9 mA, Tj = 25°C |
5.0 |
5.50 |
6.0 |
V |
| Total Gate Charge |
Qg |
VGE = -7/+15 V, VCE = 600 V, Tj = 25°C |
— |
3.17 |
— |
µC |
| Gate-Source Leakage Current |
IGES |
VGE = ±25 V, VCE = 0 V, Tj = 25°C |
-100 |
— |
100 |
nA |
| Collector-Emitter Voltage |
V(BR)CES |
VGE = 0 V, IC = 1 mA, Tj = -40°C |
— |
1200* |
— |
V |
|
|
Tj = 25°C |
1200 |
— |
— |
V |
|
|
IC = 2 mA, Tj = 150°C |
— |
1310* |
— |
V |
| Collector-Emitter Cutoff Current |
ICES |
VCE = 1200 V, VGE = 0 V, Tj = 25°C |
— |
— |
100 |
µA |
| Input Capacitance |
Ciss |
VGE = 0 V, VCE = 30 V, f = 100 KHz, Tj = 25°C |
— |
63.5 |
— |
nF |
| Output Capacitance |
Coss |
|
— |
1.83 |
— |
nF |
| Reverse Transfer Capacitance |
Crss |
|
— |
0.20 |
— |
nF |
| Turn-on Delay Time |
td(on) |
VGE = -7/+15 V, VDC+ = 400 V, VDC- = 400 V, IC = 330 A, RG(on) = 0.5 Ω, RG(off) = 0.5 Ω, Tj = 25°C |
— |
53 |
— |
ns |
|
|
Tj = 150°C |
— |
110 |
— |
ns |
| Rise Time |
tr |
Tj = 25°C |
— |
27 |
— |
ns |
|
|
Tj = 150°C |
— |
35 |
— |
ns |
| Turn-off Delay Time |
td(off) |
Tj = 25°C |
— |
194 |
— |
ns |
|
|
Tj = 150°C |
— |
205 |
— |
ns |
| Fall Time |
tf |
Tj = 25°C |
— |
155 |
— |
ns |
|
|
Tj = 150°C |
— |
268 |
— |
ns |
| Turn-on Switching Loss |
Eon |
Tj = 25°C |
— |
2.97 |
— |
mJ |
|
|
Tj = 150°C |
— |
6.17 |
— |
mJ |
| Turn-off Switching Loss |
Eoff |
Tj = 25°C |
— |
12.9 |
— |
mJ |
|
|
Tj = 150°C |
— |
17.7 |
— |
mJ |
| Thermal Resistance - Chip-to-Case |
RthJC |
Per IGBT |
— |
0.063 |
— |
°C/W |
*Engineering-stage data, mass-production data pending.
DIODE (D5, D6)
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Diode Forward Voltage |
VF (terminal) |
IF = 500 A, Tj = -40°C |
— |
1.65 |
— |
V |
|
|
Tj = 25°C |
— |
1.86 |
— |
V |
|
|
Tj = 150°C |
— |
2.06 |
— |
V |
| Reverse Recovery Time |
TRR |
VGE = -7/+15 V, VDC+ = 400 V, VDC- = 400 V, IC = 330 A, RG(on) = 0.5 Ω, RG(off) = 0.5 Ω, Tj = 25°C |
— |
151 |
— |
ns |
|
|
Tj = 150°C |
— |
210 |
— |
ns |
| Reverse Recovery Charge |
QRR |
Tj = 25°C |
— |
15.3 |
— |
µC |
|
|
Tj = 150°C |
— |
29.8 |
— |
µC |
| Peak Reverse Recovery Current |
IRRM |
Tj = 25°C |
— |
229 |
— |
A |
|
|
Tj = 150°C |
— |
293 |
— |
A |
| Reverse Recovery Energy |
EREC |
Tj = 25°C |
— |
5.0 |
— |
mJ |
|
|
Tj = 150°C |
— |
9.9 |
— |
mJ |
| Thermal Resistance - Chip-to-Case |
RthJC |
Per diode |
— |
0.135 |
— |
°C/W |
IGBT (Q2, Q3)
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Collector-Emitter Saturation Voltage |
VCE(sat) (terminal) |
VGE = 15 V, IC = 400 A, Tj = -40°C |
— |
1.44 |
— |
V |
|
|
Tj = 25°C |
— |
1.53 |
— |
V |
|
|
Tj = 150°C |
— |
1.73 |
— |
V |
| Gate-Emitter Threshold Voltage |
VGE(TH) |
VGE = VCE, IC = 9 mA, Tj = 25°C |
4.5 |
5.0 |
5.5 |
V |
| Total Gate Charge |
Qg |
VGE = -7/+15 V, VCE = 600 V, Tj = 25°C |
— |
3.14 |
— |
µC |
| Gate-Source Leakage Current |
IGES |
VGE = ±25 V, VCE = 0 V, Tj = 25°C |
-100 |
— |
100 |
nA |
| Collector-Emitter Voltage |
V(BR)CES |
VGE = 0 V, IC = 1 mA, Tj = -40°C |
— |
720 |
— |
V |
|
|
Tj = 25°C |
700 |
— |
— |
V |
|
|
Tj = 150°C |
— |
800 |
— |
V |
| Collector-Emitter Cutoff Current |
ICES |
VCE = 700 V, VGE = 0 V, Tj = 25°C |
— |
— |
100 |
µA |
| Input Capacitance |
Ciss |
VGE = 0 V, VCE = 30 V, f = 100 KHz, Tj = 25°C |
— |
48.3 |
— |
nF |
| Output Capacitance |
Coss |
|
— |
0.75 |
— |
nF |
| Reverse Transfer Capacitance |
Crss |
|
— |
0.23 |
— |
nF |
| Turn-on Delay Time (Q3) |
td(on) |
VGE = -7/+15 V, VDC+ = 400 V, VDC- = 400 V, IC = 330 A, RG(on) = 0.5 Ω, RG(off) = 9.1 Ω, Tj = 25°C |
— |
42 |
— |
ns |
|
|
Tj = 150°C |
— |
95 |
— |
ns |
| Rise Time (Q3) |
tr |
Tj = 25°C |
— |
27 |
— |
ns |
|
|
Tj = 150°C |
— |
31 |
— |
ns |
| Turn-off Delay Time (Q3) |
td(off) |
Tj = 25°C |
— |
886 |
— |
ns |
|
|
Tj = 150°C |
— |
960 |
— |
ns |
| Fall Time (Q3) |
tf |
Tj = 25°C |
— |
50 |
— |
ns |
|
|
Tj = 150°C |
— |
60 |
— |
ns |
| Turn-on Switching Loss (Q3) |
Eon |
Tj = 25°C |
— |
1.04 |
— |
mJ |
|
|
Tj = 150°C |
— |
1.96 |
— |
mJ |
| Turn-off Switching Loss (Q3) |
Eoff |
Tj = 25°C |
— |
10.2 |
— |
mJ |
|
|
Tj = 150°C |
— |
12.6 |
— |
mJ |
| Turn-on Delay Time (Q2) |
td(on) |
Tj = 25°C |
— |
93 |
— |
ns |
|
|
Tj = 150°C |
— |
93 |
— |
ns |
| Rise Time (Q2) |
tr |
Tj = 25°C |
— |
29 |
— |
ns |
|
|
Tj = 150°C |
— |
32 |
— |
ns |
| Turn-off Delay Time (Q2) |
td(off) |
Tj = 25°C |
— |
880 |
— |
ns |
|
|
Tj = 150°C |
— |
950 |
— |
ns |
| Fall Time (Q2) |
tf |
Tj = 25°C |
— |
56 |
— |
ns |
|
|
Tj = 150°C |
— |
61 |
— |
ns |
| Turn-on Switching Loss (Q2) |
Eon |
Tj = 25°C |
— |
0.68 |
— |
mJ |
|
|
Tj = 150°C |
— |
1.70 |
— |
mJ |
| Turn-off Switching Loss (Q2) |
Eoff |
Tj = 25°C |
— |
10.7 |
— |
mJ |
|
|
Tj = 150°C |
— |
13.5 |
— |
mJ |
| Thermal Resistance - Chip-to-Case |
RthJC |
Per IGBT |
— |
0.140 |
— |
°C/W |
INVERSE DIODE (D1)
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Diode Forward Voltage |
VF (terminal) |
IF = 300 A, Tj = -40°C |
— |
1.71 |
— |
V |
|
|
Tj = 25°C |
— |
1.85 |
— |
V |
|
|
Tj = 150°C |
— |
1.95 |
— |
V |
| Reverse Recovery Time |
TRR |
VGE = -7/+15 V, VDC+ = 400 V, VDC- = 400 V, IC = 330 A, RG(on) = 0.5 Ω, RG(off) = 9.1 Ω, Tj = 25°C |
— |
74 |
— |
ns |
|
|
Tj = 150°C |
— |
306 |
— |
ns |
| Reverse Recovery Charge |
QRR |
Tj = 25°C |
— |
13.2 |
— |
µC |
|
|
Tj = 150°C |
— |
38.3 |
— |
µC |
| Peak Reverse Recovery Current |
IRRM |
Tj = 25°C |
— |
328 |
— |
A |
|
|
Tj = 150°C |
— |
418 |
— |
A |
| Reverse Recovery Energy |
EREC |
Tj = 25°C |
— |
6.28 |
— |
mJ |
|
|
Tj = 150°C |
— |
15.5 |
— |
mJ |
| Thermal Resistance - Chip-to-Case |
RthJC |
Per diode |
— |
0.119 |
— |
°C/W |
INVERSE DIODE (D4)
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Diode Forward Voltage |
VF (terminal) |
IF = 400 A, Tj = -40°C |
— |
1.76 |
— |
V |
|
|
Tj = 25°C |
— |
1.98 |
— |
V |
|
|
Tj = 150°C |
— |
2.20 |
— |
V |
| Reverse Recovery Time |
TRR |
VGE = -7/+15 V, VDC+ = 400 V, VDC- = 400 V, IC = 330 A, RG(on) = 0.5 Ω, RG(off) = 9.1 Ω, Tj = 25°C |
— |
85 |
— |
ns |
|
|
Tj = 150°C |
— |
315 |
— |
ns |
| Reverse Recovery Charge |
QRR |
Tj = 25°C |
— |
15.7 |
— |
µC |
|
|
Tj = 150°C |
— |
45.5 |
— |
µC |
| Peak Reverse Recovery Current |
IRRM |
Tj = 25°C |
— |
328 |
— |
A |
|
|
Tj = 150°C |
— |
450 |
— |
A |
| Reverse Recovery Energy |
EREC |
Tj = 25°C |
— |
7.51 |
— |
mJ |
|
|
Tj = 150°C |
— |
19.0 |
— |
mJ |
| Thermal Resistance - Chip-to-Case |
RthJC |
Per diode |
— |
0.102 |
— |
°C/W |
INVERSE DIODE (D2, D3)
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Diode Forward Voltage |
VF (terminal) |
IF = 100 A, Tj = -40°C |
— |
1.51 |
— |
V |
|
|
Tj = 25°C |
— |
1.58 |
— |
V |
|
|
Tj = 150°C |
— |
1.63 |
— |
V |
NTC-Thermistor
| Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Conditions |
| Rated resistance |
R25 |
— |
5 |
— |
kΩ |
TC = 25°C |
| Deviation of R100 |
ΔR/R |
-5 |
— |
5 |
% |
TC = 100°C, R100 = 493 Ω |
| B-value |
B25/50 |
— |
3375 |
— |
K |
|
Module Characteristics
| Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Conditions |
| Mounting Torque (Screw M5) |
M |
3.0 |
— |
5.0 |
N·m |
|
| Creepage Distance |
|
— |
16.2 |
— |
mm |
terminal to heatsink |
| Clearance |
|
— |
15.2 |
— |
mm |
terminal to heatsink |
| CTI |
|
— |
≥600 |
— |
|
|
| Flatness of base plate |
|
— |
— |
0.3 |
mm |
|
Notes:
Confidential Shared Under NDA.