SMT12T07AHAG 产品图

产品详情

SMT12T07AHAG

中晶新源 SineSemi核心代理商

晶圆/裸片Wafer

参数规格

工艺
SGT
结构
N
漏源电压 VDS
120 V
导通电阻 RDS(ON)@10V 最大
6.7 mΩ
导通电阻 RDS(ON)@10V 典型
5.6 mΩ
阈值电压 VGS(th) 典型
3 V
With ESD
No
Die Size (μm×μm)
3300*2350
Gross Die (8" wafer)
3601
Wafer Thickness (μm)
175±15
栅源电压 VGS 最大
±20 V
输入电容 Ciss 典型
2119 pF
输出电容 Coss 典型
928 pF
反向传输电容 Crss 典型
17 pF
总栅极电荷 Qg 典型
32 nC
Qgs_Typ
8.5 nC
Qgd_Typ
6.6 nC
结温 Tj
175 °C
原厂备注
SGT N

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SMT12T07AHAG

120V N-Channel Power MOSFET (Wafer Datasheet)

Product Summary
  • VDS = 120V
  • RDS(ON), max = 5.3mΩ (VGS = 10V)
Chip Information
Parameter Value
Die Size (with scribe line) 3300µm × 2350µm
Gate Pad Size 280µm × 432µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 175µm ± 15µm
Wafer Diameter 8 inch
Passivation Yes
Front Metal Composition & Thickness AlCu 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.5µm
Gross Die (approximately) 3,605
Ordering Information
Orderable Part Number Wafer Description
SMT12T07AHAG Sampling Tested Wafer
SMT12T07AHAG-C Full CP Tested Wafer
Maximum Ratings (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage VDS 120 V
Gate - Source Voltage VGS ±20 V
Junction Temperature Range TJ -55 ~ +175 °C
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 120 V
Zero Gate Voltage Drain Current IDSS VDS = 120V, VGS = 0V 1.0 µA
Gate-Body Leakage Current IGSS VGS = ±20V, VDS = 0V ±100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 2.0 3.0 4.0 V
Static Drain-Source On-Resistance (1) RDS(ON) VGS = 10V, ID = 20A 5.3 6.4
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V 0.7 1.0 V

Notes:

  1. RDS(ON) value is referred by the device assembled in PDFN5060-8L.