SMV20N50AHT 产品图

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SMV20N50AHT

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高压 MOSFET

参数规格

结温 Tj
150 °C
漏源电压 VDS
500 V
漏极电流 ID
20 A
导通电阻 RDS(ON)@10V 典型
240 mΩ
导通电阻 RDS(ON)@10V 最大
300 mΩ
栅源电压 VGS 最大
±30 V
雪崩能量 EAS 最大
1500 mJ
输入电容 Ciss 典型
2670 pF
输出电容 Coss 典型
260 pF
反向传输电容 Crss 典型
35 pF
总栅极电荷 Qg 典型
65 nC

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SMV20N50AHS / SMV20N50AHF

500V N-Channel MOSFET

Lead Free Package and Finish

General Features
  • Proprietary New Planar Technology
  • R_DS(on), typ =0.24 Ω@V_GS=10V
  • Low Gate Charge Minimize Switching Loss
  • Fast Recovery Body Diode
BV_DSS R_DS(ON), typ I_D
500V 0.24Ω 20A
Applications
  • Adaptor Charger
  • SMPS Power Supply
  • LCD Panel Power
Ordering Information
Part Number Package
SMV20N50AHS TO-220
SMV20N50AHF TO-220F
Absolute Maximum Ratings (@ T_C = 25°C, unless otherwise specified.)
Symbol Parameter SMV20N50AHS SMV20N50AHF Unit
V_DSS Drain-to-Source Voltage ^(1) 500 500 V
V_GSS Gate-to-Source Voltage ±30 ±30 V
I_D Continuous Drain Current 20 20 A
E_AS Single Pulse Avalanche Energy 1500 1500 mJ
dv/dt Peak Diode Recovery dv/dt ^(3) 5.0 5.0 V/ns
P_D Power Dissipation 175 60 W
Derating Factor above 25°C 1.40 0.48 W/°C
T_J & T_STG Operating and Storage Temperature Range -55 to 150 -55 to 150 °C
Thermal Characteristics
Symbol Parameter PTP20N50A PTA20N50A Unit
R_θJC Thermal Resistance, Junction-to-Case 0.71 2.08 °C/W
R_θJA Thermal Resistance, Junction-to-Ambient 62 100 °C/W

Electrical Characteristics

OFF Characteristics (T_J = 25°C, unless otherwise specified.)
Symbol Parameter Min Typ Max Unit Test Conditions
BV_DSS Drain-to-Source Breakdown Voltage 500 V V_GS=0V, I_D=250uA
I_DSS Drain-to-Source Leakage Current 1 µA V_DS=500V, V_GS=0V
100 µA V_DS=400V, V_GS=6V, T_J=125°C
I_GSS Gate-to-Source Leakage Current +100 nA V_GS=+30V, V_DS=0V
-100 nA V_GS=-30V, V_DS=0V
ON Characteristics (T_J = 25°C, unless otherwise specified.)
Symbol Parameter Min Typ Max Unit Test Conditions
R_DS(on) Static Drain-to-Source On-Resistance 0.24 0.3 Ω V_GS=10V, I_D=10A
V_GS(th) Gate Threshold Voltage 2.0 4.0 V V_DS=V_GS, I_D=250uA
g_fs Forward Transconductance ^(6) 18 S VDS=15V, ID=10A
Dynamic Characteristics (Essentially independent of operating temperature)
Symbol Parameter Min Typ Max Unit Test Conditions
C_iss Input Capacitance 2670 pF V_GS=0V, V_DS=25V, f=1.0MHz
C_rss Reverse Transfer Capacitance 35 pF
C_oss Output Capacitance 260 pF
Q_g Total Gate Charge 65 nC V_DS=250V, I_D=20A, V_GS=0 to 10V
Q_gs Gate-to-Source Charge 14 nC
Q_gd Gate-to-Drain (Miller) Charge 24 nC
Resistive Switching Characteristics (Essentially independent of operating temperature)
Symbol Parameter Min Typ Max Unit Test Conditions
t_d(ON) Turn-on Delay Time 35 ns V_DD=250V, I_D=20A, V_GS= 10V, R_G=25 Ω
t_RR Rise Time 75 ns
t_d(OFF) Turn-Off Delay Time 165 ns
t_fall Fall Time 85 ns
Source-Drain Body Diode Characteristics (T_J = 25°C, unless otherwise specified.)
Symbol Parameter Min Typ Max Unit Test Conditions
I_SD Continuous Source Current ^(1) 20 A Integral PN-diode in MOSFET
I_SM Pulsed Source Current ^(4) 80 A
V_SD Diode Forward Voltage 1.5 V I_SD=20A, V_GS=0V
trr Reverse recovery time 320 ns V_GS=0V, I_rr=20A, di/dt=100A/µs
Qrr Reverse recovery charge 3.0 µC

Notes:

  1. T_J=+25°C to +150°C.
  2. Repetitive rating, pulse width limited by maximum junction temperature.
  3. I_SD= 20A, di/dt < 100 A/µs, VDD < BV(dss), T_J=+150°C.
  4. Pulse width≤380µs, duty cycle≤2%.