SMT8502AHT 85V/232A | SineSemi LV & MV MOSFETs

Specifications

Compiled from the manufacturer's datasheet; the official document prevails.

V_DS	R_DS(ON), max	I_D, max
— V	— mΩ @ V_GS = 10V	232 A

TO220-3L

Parameter	Symbol	Value	Units
Drain - Source Voltage	V_DS	85	V
Gate - Source Voltage	V_GS	±20	V
Continuous Drain Current (V_GS = 10V) ⁽¹⁾	I_D @ T_C = 25°C	232	A
	I_D @ T_C = 100°C	147	A
Pulsed Drain Current ⁽²⁾	I_DM	929	A
Single Pulse Avalanche Energy ⁽³⁾	E_AS	1300	mJ
Single Pulse Avalanche Current (L = 0.1mH)	I_AS	94	A
Power Dissipation	P_D @ T_C = 25°C	227	W
	P_D @ T_C = 100°C	91	W
Junction & Storage Temperature Range	T_J, T_STG	-55~+150	°C

Parameter	Symbol	Typ	Max	Unit
Thermal Resistance, Junction-to-Ambient ⁽⁴⁾	R_θJA	29	34	°C/W
Thermal Resistance, Junction-to-Case ⁽⁵⁾	R_θJC	0.42	0.55	°C/W

Parameter	Symbol	Test Condition	Min	Typ	Max	Units
Drain-Source Breakdown Voltage	V_(BR)DSS	V_GS = 0V, I_D = 250µA	85	—	—	V
		V_DS = 85V, V_GS = 0V	—	—	1.0	µA
Zero Gate Voltage Drain Current	I_DSS	T_J = 125°C	—	—	100	µA
Gate-Source Leakage Current	I_GSS	V_GS = ±20V, V_DS = 0V	—	—	±100	nA

Parameter	Symbol	Test Condition	Min	Typ	Max	Units
Gate Threshold Voltage	V_GS(th)	V_GS = V_DS, I_D = 250µA	2.0	3.0	4.0	V
Static Drain-Source On-Resistance	R_DS(on)	—	—	—	—	mΩ
Forward Transconductance	g_fs	V_DS = 5.0V, I_D = 20A	—	55	—	S
Diodes Forward Voltage	V_SD	I_S = 2.0A, V_GS = 0V	—	0.7	1.2	V

Parameter	Symbol	Test Condition	Min	Typ	Max	Units
Input Capacitance	C_iss		—	7223	—	pF
Output Capacitance	C_oss	V_DS = 40V, V_GS = 0V, f = 1MHz	—	1443	—	pF
Reverse Transfer Capacitance	C_rss		—	44	—	pF
Gate Resistance	R_g	V_GS = 0V, V_DS = 0V, f = 1MHz	—	1.6	—	Ω

Parameter	Symbol	Test Condition	Min	Typ	Max	Units
Turn-On Delay Time	t_d(on)		—	20	—	ns
Rise Time	t_r	V_DS = 40V, V_GS = 10V	—	35	—	ns
Turn-Off Delay Time	t_d(off)	I_D = 20A, R_GEN = 3.0Ω	—	54	—	ns
Fall Time	t_f		—	30	—	ns

Parameter	Symbol	Test Condition	Min	Typ	Max	Units
Total Gate Charge (V_GS = 10V)	Q_g		—	100	—	nC
Gate-Source Charge	Q_gs	V_DS = 40V, I_D = 20A	—	32	—	nC
Gate-Drain Charge	Q_gd		—	22	—	nC
Gate Plateau Voltage	V_plateau		—	4.9	—	V

Parameter	Symbol	Test Condition	Min	Typ	Max	Units
Body Diode Reverse Recovery Time	t_rr	I_S = 20A, di/dt = 100A/µs	—	68	—	ns
Body Diode Reverse Recovery Charge	Q_rr	T_J = 25°C	—	152	—	nC
Diode Forward Current	I_S	T_J = 25°C	—	—	232	A

Notes:

This current is chip limited, which is calculated based on Rthjc.
This current is calculated on single pulse with 10μs Single Pulse.
Defined by design, not subject to production test, EAS condition: TJ=25°C, VDD=40V, VGS=10V, L=1.0mH.
Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
Thermal resistance from junction to the exposed pad.
Short duration pulse test used to minimize self-heating effect.
Defined by design, not subject to production.