SMT12T07AHS product image

Product Detail

SMT12T07AHS

SineSemi 中晶新源Core Authorized Distributor

LV & MV MOSFETsTO220-3L
Download Datasheet

Specifications

Package
TO220-3L
Configuration
N
VDS_Max
120 V
ID
105 A
RDS(ON)_Max @VGS=10V
7.1 mΩ
Automotive (Y/N)
N
VGS(th)_Typ
3 V
RDS(ON)_Typ @VGS=10V
5.9 mΩ
VGS_Max
±20 V
Tj
175 °C
EAS_Max
336 mJ
Ciss_Typ
2119 pF
Coss_Typ
928 pF
Crss_Typ
17 pF
Qg_Typ
32 nC
ESD
No
MPQ
1000 pcs
MOQ
5000 pcs
App: Motor Drive
Y
App: HF Power
Y
App: Battery Protection
Y
App: General Switch
Y

Package & Schematic

SMT12T07AHS package outline, pin configuration and schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SMT12T07AHS(T)

120V N-Channel Power MOSFET

Product Summary
VDS RDS(ON), max ID, max Package
120 V 6.8 mΩ @ VGS = 10V 105 A TO263-3L
120 V 7.1 mΩ @ VGS = 10V TO220-3L

TO220-3L / TO263-3L

Features
  • Low On-Resistance
  • Excellent FoM (figure of merit)
  • 100% ∆VDS & UIS & Rg Tested
  • RoHS compliant, HALOGEN FREE
Ordering Information
Orderable Part Number Package Type Device Marking Form Quantity (pcs)
SMT12T07AHS TO220-3L 12T07AH Tube 50
SMT12T07AHT TO263-3L 12T07AH 13" Tape&Reel 1,000
Maximum Ratings (@ TA = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage VDS 120 V
Gate - Source Voltage VGS ±20 V
Continuous Drain Current (VGS = 10V) (1) ID TA = 25°C: 105 A
TA = 100°C: 74 A
Pulsed Drain Current (2) IDM 418 A
Single Pulse Avalanche Energy (3) EAS 336 mJ
Single Pulse Avalanche Current (L = 0.1mH) IAS 47 A
Power Dissipation PD TA = 25°C: 158 W
TA = 100°C: 79 W
Junction & Storage Temperature Range TJ, TSTG -55 ~ +175 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient (4) R_θJA 36 45 °C/W
Thermal Resistance, Junction-to-Case (5) R_θJC 0.73 0.95 °C/W

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Off Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 120 V
Zero Gate Voltage Drain Current IDSS VDS = 120V, VGS = 0V 1.0 µA
TJ = 125°C 100 µA
Gate-Source Leakage Current IGSS VGS = ±20V, VDS = 0V ±100 nA
On Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 2.0 3.0 4.0 V
Static Drain-Source On-Resistance RDS(on) VGS = 10V, ID = 20A (TO263-3L) 5.7 6.8
VGS = 10V, ID = 20A (TO220-3L) 5.9 7.1
Forward Transconductance gfs VDS = 5.0V, ID = 20A 35 S
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V 0.7 1.2 V
Dynamic Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Input Capacitance Ciss VDS = 60V, VGS = 0V, f = 1MHz 2119 pF
Output Capacitance Coss 928 pF
Reverse Transfer Capacitance Crss 17 pF
Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 1.1 Ω
Switching Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Turn-On Delay Time td(on) VGS = 10V, VDS = 60V 6.8 ns
Rise Time tr ID = 20A, RGEN = 3.0Ω 8.7 ns
Turn-Off Delay Time td(off) 18 ns
Fall Time tf 9.0 ns
Gate Charge Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Total Gate Charge (VGS = 10V) Qg VDS = 60V, ID = 25A 32 nC
Total Gate Charge (VGS = 6.0V) Qg 20 nC
Gate-Source Charge Qgs VGS = 10V 8.5 nC
Gate-Drain Charge Qgd 6.6 nC
Gate Plateau Voltage Vplateau 4.4 V
Drain-Source Diode Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Body Diode Reverse Recovery Time trr IS = 20A, di/dt = 100A/µs 60 ns
Body Diode Reverse Recovery Charge Qrr TJ = 25°C 123 nC
Diode Forward Current IS TA = 25°C 105 A

Notes:

  1. This current is chip limited, which is calculated based on RθJC.
  2. This current is calculated on single pulse with 10µs Pulse & Duty Cycle = 1%.
  3. Defined by design, not subject to production test. EAS condition, TJ=25°C, VDS=60V, VGS=10V, L=1.0mH.
  4. Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
  5. Thermal resistance from junction to the exposed pad.
  6. Short duration pulse test used to minimize self-heating effect.
  7. Defined by design; not subject to production.