SMT10T02BHTL product image

Product Detail

SMT10T02BHTL

SineSemi 中晶新源Core Authorized Distributor

LV & MV MOSFETsTOLL
Download Datasheet

Specifications

Package
TOLL
Configuration
N
VDS_Max
100 V
ID
249 A
RDS(ON)_Max @VGS=10V
2.4 mΩ
Automotive (Y/N)
N
VGS(th)_Typ
3 V
RDS(ON)_Typ @VGS=10V
2 mΩ
VGS_Max
±20 V
Tj
150 °C
EAS_Max
1300 mJ
Ciss_Typ
6897 pF
Coss_Typ
1572 pF
Crss_Typ
58 pF
Qg_Typ
91 nC
ESD
No
MPQ
2000 pcs
MOQ
20000 pcs
App: Motor Drive
Y
App: HF Power
Y
App: Battery Protection
Y
App: General Switch
Y

Package & Schematic

SMT10T02BHTL package outline, pin configuration and schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SMT10T02BHTL

100V N-Channel Power MOSFET

Product Summary
VDS RDS(ON), max ID, max
100 V 2.4 mΩ @ VGS = 10V 249 A

TOLL

Features
  • Low On-Resistance
  • Excellent FoM (figure of merit)
  • 100% ΔVDS & UIS & Rg Tested
Applications
  • DC/DC in Telecoms and Industrial
  • Synchronous Rectification in SMPS
  • Hard Switching and High Speed Circuit
Mechanical Data
  • Green Molding Compound
  • Moisture Sensitivity: Level 1 per J-STD-020
  • UL Flammability Classification Rating 94V-0
Ordering Information
Orderable Part Number Package Type Device Marking Form Quantity (pcs)
SMT10T02BHTL TOLL 10T02BH 13'' Tape&Reel 2,000
Maximum Ratings (@ TC = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage VDS 100 V
Gate - Source Voltage VGS ±20 V
Continuous Drain Current (VGS = 10V) (1) ID TC = 25°C: 249 A
TC = 100°C: 157 A
Pulsed Drain Current (2) IDM 996 A
Single Pulse Avalanche Energy (3) EAS 1300 mJ
Single Pulse Avalanche Current (L = 0.1mH) IAS 60 A
Power Dissipation (4) PD TC = 25°C: 278 W
TC = 100°C: 111 W
Junction & Storage Temperature Range TJ, TSTG -55~+150 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient (4) R_θJA 25 32 °C/W
Thermal Resistance, Junction-to-Case (5) R_θJC 0.34 0.45 °C/W

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Off Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 100 V
Zero Gate Voltage Drain Current IDSS VDS = 100V, VGS = 0V 1.0 µA
Gate-Source Leakage Current IGSS VGS = ±20V, VDS = 0V ±100 nA
On Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 2.0 3.0 4.0 V
Static Drain-Source On-Resistance RDS(on) VGS = 10V, ID = 80A 2.0 2.4
Forward Transconductance gfs VDS = 5.0V, ID = 20A 56 S
Diode Forward Voltage VSD IS = 2.0A, VGS = 0V 0.7 1.2 V
Dynamic Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Input Capacitance Ciss VDS = 50V, VGS = 0V, f = 1MHz 6897 pF
Output Capacitance Coss 1572 pF
Reverse Transfer Capacitance Crss 58 pF
Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 1.3 Ω
Switching Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Turn-On Delay Time td(on) VGS = 10V, VDS = 50V 14 ns
Rise Time tr ID = 80A, RGEN = 3.0Ω 23 ns
Turn-Off Delay Time td(off) 48 ns
Fall Time tf 26 ns
Gate Charge Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Total Gate Charge (VGS = 10V) Qg VDS = 50V, ID = 80A 91 nC
Total Gate Charge (VGS = 70V) Qg VDS = 50V, ID = 80A 67 nC
Gate-Source Charge Qgs 27 nC
Gate-Drain Charge Qgd 20 nC
Gate Plateau Voltage Vplateau 4.6 V
Drain-Source Diode Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Body Diode Reverse Recovery Time trr IS = 80A, di/dt = 100A/µs 60 ns
Body Diode Reverse Recovery Charge Qrr TJ = 25°C 106 nC
Diode Forward Current IS TC = 25°C 249 A