Specifications
- Package
- TO263-3L
- Tj
- 150 °C
- VDS_Max
- 800 V
- ID_Max
- 17 A
- VGS(th)_Typ
- 3.5 V
- RDS(ON)_Typ @VGS=10V
- 280 mΩ
- RDS(ON)_Max @VGS=10V
- 360 mΩ
- VGS_Max
- ±30 V
- EAS_Max
- 506 mJ
- Ciss_Typ
- 1290 pF
- Coss_Typ
- 47 pF
- Crss_Typ
- 1.8 pF
- Qg_Typ
- 30 nC
Not sure how to choose? Read the HV MOSFETs Selection Guide →
Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SMJ80R360ANT
800V Super Junction N-Channel Power MOSFET
Product Summary
| VDS |
RDS(ON), max |
ID, max |
| 800 V |
360 mΩ @ VGS = 10V |
17 A |
TO263-3L
Features
- Low On-Resistance
- Fast Switching Capability
- 100% UIS and Rg tested
- RoHS compliant, HALOGEN FREE
Applications
- AC/DC power supply
- PC power
- Telecom/Server
- Solar invertor
Mechanical Data
- Green Molding Compound
- Moisture Sensitivity: Level 3 per J-STD-020
- UL Flammability Classification Rating 94V-0
Ordering Information
| Orderable Part Number |
Package Type |
Device Marking |
Form |
Quantity (pcs) |
| SMJ80R360ANT |
TO263-3L |
80R360AN |
13" Tape&Reel |
800 |
Maximum Ratings (@ TA = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Value |
Unit |
| Drain - Source Voltage |
VDS |
800 |
V |
| Gate - Source Voltage |
VGS |
±30 |
V |
| Continuous Drain Current (VGS = 10V) (1) |
ID |
TA = 25°C: 17 |
A |
|
|
TA = 125°C: 7.5 |
A |
| Pulsed Drain Current (2) |
IDM |
51 |
A |
| Single Pulse Avalanche Energy (3) |
EAS |
506 |
mJ |
| Single Pulse Avalanche Current (L = 50.0mH) |
IAS |
4.5 |
A |
| Power Dissipation |
PD |
TA = 25°C: 227 |
W |
| MOSFET dv/dt Ruggedness, VDS = 0...520V |
— |
dv/dt |
50 |
| Reverse Diodes dv/dt, VDS = 0...400V, IDR < IS |
— |
dv/dt |
50 |
| Junction & Storage Temperature Range |
TJ, TSTG |
-55 ~ +150 |
°C |
Thermal Characteristics
| Parameter |
Symbol |
Typ |
Max |
Unit |
| Thermal Resistance, Junction-to-Ambient (4) |
R_θJA |
— |
62 |
°C/W |
| Thermal Resistance, Junction-to-Case (5) |
R_θJC |
— |
0.55 |
°C/W |
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
Off Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Drain-Source Breakdown Voltage |
V(BR)DSS |
VGS = 0V, ID = 250µA |
800 |
— |
— |
V |
| Zero Gate Voltage Drain Current |
IDSS |
VDS = 800V, VGS = 0V |
— |
— |
1.0 |
µA |
| Gate-Source Leakage Current |
IGSS |
VGS = ±30V, VDS = 0V |
— |
— |
±100 |
nA |
On Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Gate Threshold Voltage |
VGS(th) |
VDS = VGS, ID = 250µA |
2.5 |
3.5 |
4.5 |
V |
| Static Drain-Source On-Resistance |
RDS(on) |
VGS = 10V, ID = 12A |
— |
280 |
360 |
mΩ |
| Diodes Forward Voltage |
VSD |
IS = 5.5A, VGS = 0V |
— |
0.81 |
— |
V |
Dynamic Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Input Capacitance |
Ciss |
VDS = 100V, VGS = 0V, f = 250kHz |
— |
1290 |
— |
pF |
| Output Capacitance |
Coss |
|
— |
47 |
— |
pF |
| Reverse Transfer Capacitance |
Crss |
|
— |
1.8 |
— |
pF |
| Effective Output Capacitance, Energy Related (8) |
Co(er) |
VDS = 0V... |
— |
36 |
— |
pF |
| Effective Output Capacitance, Time Related (9) |
Co(tr) |
VDS = 0...500V |
— |
133 |
— |
pF |
| Gate Resistance |
Rg |
VGS = 0V, VDS = 0V, f = 1MHz |
— |
5.0 |
— |
Ω |
Switching Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Turn-On Delay Time |
td(on) |
VGS = 10V, VDS = 400V |
— |
50 |
— |
ns |
| Rise Time |
tr |
ID = 8A |
— |
19 |
— |
ns |
| Turn-Off Delay Time |
td(off) |
RG = 5Ω |
— |
84 |
— |
ns |
| Fall Time |
tf |
|
— |
9.0 |
— |
ns |
Gate Charge Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Total Gate Charge (VGS = 10V) |
Qg |
VDS = 640V, ID = 6.0A |
— |
30 |
— |
nC |
| Gate-Source Charge |
Qgs |
|
— |
4.0 |
— |
nC |
| Gate-Drain Charge |
Qgd |
Qg = 0...10V |
— |
9.6 |
— |
nC |
| Gate Plateau Voltage |
Vplateau |
|
— |
5.7 |
— |
V |
Drain-Source Diode Characteristics (7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Body Diode Reverse Recovery Time |
trr |
IS = 6.0A, di/dt = 100A/µs, VR = 650V |
— |
226 |
— |
ns |
| Body Diode Reverse Recovery Charge |
Qrr |
TJ = 25°C |
— |
3.1 |
— |
µC |
| Body Diode Reverse Recovery Current |
IRRM |
|
— |
26 |
— |
A |
| Diode Forward Current |
IS |
TA = 25°C |
— |
— |
17 |
A |
Notes:
- This current is chip limited, which is calculated based on RθJC.
- This current is calculated on single pulse with 10µs Pulse & Duty Cycle = 1%.
- Defined by design, not subject to production test. TJ=25°C, VDS=18V, VGS=10V, L=4.5A.
- Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
- Thermal resistance from junction to soldering point (on the exposed drain pad).
- Short duration pulse test used to minimize self-heating effect.
- Defined by design; not subject to production.
- Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 480V.
- Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 480V.
