SineSemi has introduced its automotive-grade PDFN5060-8L-W package, which uses a lead-fused pin design on the S (source) terminal together with wettable flanks.
Compared with the conventional PDFN5060-8L package, the design raises the source-to-PCB contact area by about 70% and lifts maximum package current capability from 100 A to 120 A (about 20%), for higher current density and better board-level heat dissipation; the wettable flanks ease AOI inspection after reflow and support the solder-joint reliability expected of automotive packages. In SineSemi's thermal-simulation comparison at 300 W input, the lead-fused package's lead area peaks at about 117.7°C, roughly 22°C below the conventional PDFN5060-8L's ~139.1°C.
Package thermal-simulation comparison at 300 W input. Image: SineSemi
The reference application is a 300 W, 100 kHz LLC dual-output supply: the rectification-side devices Q3–Q6 use SMT4003AHPWQ, with a system input of 115 V/230 V AC, an output of 12 V/25 A (300 W) and a system efficiency of 94%.
300 W / 100 kHz LLC dual-output circuit outline (Q3–Q6 use SMT4003AHPWQ). Image: SineSemi
Selection and samples for PDFN5060-8L-W parts, SMT4003AHPWQ included, are handled through a part-number inquiry.
Source: SineSemi Product News · www.sinesemi.com/cpxw/39.html