SMT6001BLPC 产品图

产品详情

SMT6001BLPC

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晶圆/裸片Wafer

参数规格

工艺
SGT
结构
N
漏源电压 VDS
60 V
导通电阻 RDS(ON)@10V 最大
1.1 mΩ
导通电阻 RDS(ON)@10V 典型
0.9 mΩ
阈值电压 VGS(th) 典型
1.7 V
With ESD
No
Die Size (μm×μm)
4140*3420
Gross Die (8" wafer)
1889
Wafer Thickness (μm)
90±10
栅源电压 VGS 最大
±20 V
导通电阻 RDS(ON)@4.5V 典型
1.2 mΩ
导通电阻 RDS(ON)@4.5V 最大
1.5 mΩ
输入电容 Ciss 典型
6518 pF
输出电容 Coss 典型
2947 pF
反向传输电容 Crss 典型
122 pF
总栅极电荷 Qg 典型
119 nC
Qgs_Typ
16 nC
Qgd_Typ
25 nC
结温 Tj
175 °C
原厂备注
SGT With Plating

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SMT6001BLPC

60V N-Channel Power MOSFET

Product Summary
  • VDS = 60V
  • RDS(ON), max = 0.9mΩ (VGS = 10V)
  • RDS(ON), max = 1.2mΩ (VGS = 4.5V)
Potential Applications
  • Load Switching
  • Motor Driver
  • High Frequency Switching
Chip Information
Parameter Value
Die Size (with scribe line) 4140µm × 3420µm
Gate Pad Size 390µm × 350µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 90µm ± 10µm
Wafer Diameter 8 inch
Polyimide Yes
Front Metal Composition & Thickness NiPdAu,3µm/0.05µm/0.03µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.3µm
Gross Die (approximately) 1,996
Ordering Information
Orderable Part Number Wafer Description
SMT6001BLPC Sampling Tested Wafer
SMT6001BLPC-C Full CP Tested Wafer
Maximum Ratings (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage VDS 60 V
Gate - Source Voltage VGS ±20 V
Junction Temperature Range TJ -55 ~ +175 °C

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 60 — — V
Zero Gate Voltage Drain Current IDSS VDS = 60V, VGS = 0V — — 1.0 µA
Gate-Body Leakage Current IGSS VGS = ±20V, VDS = 0V — — ±100 nA
Gate Threshold Voltage VGS(th) VGS = VDS, ID = 250µA 1.2 1.7 2.6 V
Static Drain-Source On-Resistance (1) RDS(on) VGS = 10V, ID = 20A — 0.9 1.1 mΩ
VGS = 4.5V, ID = 15A — 1.2 1.5 mΩ
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V — 0.7 1.0 V

Notes:

  1. RDS(on) value is referred by the device assembled in PDFN5060-8L.