SMT10T130ALAE 产品图

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SMT10T130ALAE

中晶新源 SineSemi核心代理商

晶圆/裸片Wafer

参数规格

工艺
SGT
结构
N
漏源电压 VDS
100 V
导通电阻 RDS(ON)@10V 最大
129 mΩ
导通电阻 RDS(ON)@10V 典型
108 mΩ
阈值电压 VGS(th) 典型
1.8 V
With ESD
No
Die Size (μm×μm)
650*650
Gross Die (8" wafer)
67952
Wafer Thickness (μm)
150±15
栅源电压 VGS 最大
±20 V
导通电阻 RDS(ON)@4.5V 典型
135 mΩ
导通电阻 RDS(ON)@4.5V 最大
170 mΩ
输入电容 Ciss 典型
92 pF
输出电容 Coss 典型
95 pF
反向传输电容 Crss 典型
13.7 pF
总栅极电荷 Qg 典型
2.2 nC
Qgs_Typ
0.27 nC
Qgd_Typ
0.57 nC
结温 Tj
150 °C
原厂备注
SGT N

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SMT10T130ALAE

100V N-Channel Power MOSFET (Wafer Datasheet)

Product Summary
  • VDS = 100V
  • RDS(ON), max = 100mΩ (VGS = 10V)
  • RDS(ON), max = 140mΩ (VGS = 4.5V)
Chip Information
Parameter Value
Die Size (with scribe line) 650µm × 650µm
Gate Pad Size 140µm × 140µm
Source Pad Size Full Metalized Source
Scribe Line Width 60µm
Wafer Thickness 150µm ± 15µm
Wafer Diameter 8 inch
Passivation Yes
Front Metal Composition & Thickness AlCu, 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.5µm
Gross Die (approximately) 67,952
Ordering Information
Orderable Part Number Wafer Description
SMT10T130ALAE Sampling Tested Wafer
SMT10T130ALAE-C Full CP Tested Wafer
Maximum Ratings (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage VDS 100 V
Gate - Source Voltage VGS ±20 V
Junction Temperature Range TJ -55 ~ +150 °C
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 100 V
Zero Gate Voltage Drain Current IDSS VDS = 100V, VGS = 0V 1.0 µA
Gate-Body Leakage Current IGSS VGS = ±20V, VDS = 0V ±100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 1.2 1.7 2.5 V
Static Drain-Source On-Resistance (1) RDS(ON) VGS = 10V, ID = 1.0A 100 125
VGS = 4.5V, ID = 1.0A 140 175
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V 0.7 1.0 V

Notes:

  1. RDS(ON) value is referred by the device assembled in SOT-23.