SMT10T15ALAE 产品图

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SMT10T15ALAE

中晶新源 SineSemi核心代理商

晶圆/裸片Wafer

参数规格

工艺
SGT
结构
N
漏源电压 VDS
100 V
导通电阻 RDS(ON)@10V 最大
15.9 mΩ
导通电阻 RDS(ON)@10V 典型
13.3 mΩ
阈值电压 VGS(th) 典型
1.7 V
With ESD
No
Die Size (μm×μm)
2000*1350
Gross Die (8" wafer)
10667
Wafer Thickness (μm)
150±15
栅源电压 VGS 最大
±20 V
导通电阻 RDS(ON)@4.5V 典型
16.8 mΩ
导通电阻 RDS(ON)@4.5V 最大
21 mΩ
输入电容 Ciss 典型
745 pF
输出电容 Coss 典型
331 pF
反向传输电容 Crss 典型
8.5 pF
总栅极电荷 Qg 典型
13 nC
Qgs_Typ
2.2 nC
Qgd_Typ
2.8 nC
结温 Tj
150 °C
原厂备注
SGT N

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SMT10T15ALAE

100V N-Channel Power MOSFET (Wafer Datasheet)

Product Summary
  • VDS = 100V
  • RDS(ON), max = 12.0mΩ (VGS = 10V)
  • RDS(ON), max = 16.2mΩ (VGS = 4.5V)
Chip Information
Parameter Value
Die Size (with scribe line) 2000µm × 1300µm
Gate Pad Size 155µm × 155µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 150µm ± 15µm
Wafer Diameter 8 inch
Passivation Yes
Front Metal Composition & Thickness AlCu, 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.5µm
Gross Die (approximately) 10,501
Ordering Information
Orderable Part Number Wafer Description
SMT10T15ALAE Sampling Tested Wafer
SMT10T15ALAE-C Full CP Tested Wafer
Maximum Ratings (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage VDS 100 V
Gate - Source Voltage VGS ±20 V
Junction Temperature Range TJ -55 ~ +175 °C
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 100 — — V
Zero Gate Voltage Drain Current IDSS VDS = 100V, VGS = 0V — — 1.0 µA
Gate-Body Leakage Current IGSS VGS = ±20V, VDS = 0V — — ±100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 1.2 1.7 2.5 V
Static Drain-Source On-Resistance (1) RDS(ON) VGS = 10V, ID = 20A — 12.0 15.0 mΩ
VGS = 4.5V, ID = 15A — 16.2 21 mΩ
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V — 0.7 1.0 V

Notes:

  1. RDS(ON) value is referred by the device assembled in PDFN5060-8L.