产品详情
SMJ60R040CFY
中晶新源 SineSemi核心代理商
高压 MOSFETTO247-3L
参数规格
- 封装
- TO247-3L
- 结温 Tj
- 150 °C
- 漏源电压 VDS
- 600 V
- 漏极电流 ID
- 83 A
- 阈值电压 VGS(th) 典型
- 3.7 V
- 导通电阻 RDS(ON)@10V 典型
- 33.5 mΩ
- 导通电阻 RDS(ON)@10V 最大
- 40 mΩ
- 栅源电压 VGS 最大
- ±20 V
- 雪崩能量 EAS 最大
- 1600 mJ
- 输入电容 Ciss 典型
- 4001 pF
- 输出电容 Coss 典型
- 89 pF
- 反向传输电容 Crss 典型
- 26 pF
- 总栅极电荷 Qg 典型
- 140 nC
在线规格书
以下内容整理自原厂规格书，实际参数以原厂正式文件为准。
SMJ60R040CFY
600V Super Junction MOSFET
Product Summary
| V_DS |
R_DS(ON), max |
I_D, max |
| 600 V |
40 mΩ @ V_GS = 10V |
83 A |
TO247-3L
Features
- Low On-Resistance
- Excellent FoM (figure of merit)
- Ultra fast body diode
- 100% UIS and R_g tested
- RoHS compliant, HALOGEN FREE
Applications
- Motor Drive
- Li- Battery Protection
- Power Management for High Performance Application
Mechanical Data
- Green Molding Compound
- Moisture Sensitivity: Level 1 per J-STD-020
- UL Flammability Classification Rating 94V-0
Ordering Information
| Orderable Part Number |
Package Type |
Device Marking |
Form |
Quantity (pcs) |
| SMJ60R040CFY |
TO247-3L |
60R040CF |
Tube |
30 |
Maximum Ratings (@ T_A = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Value |
Unit |
| Drain - Source Voltage |
V_DS |
600 |
V |
| Gate - Source Voltage |
V_GS |
±20 |
V |
| Continuous Drain Current (V_GS = 10V) ^(1) |
I_D |
T_A = 25°C: 83 |
A |
|
|
T_A = 100°C: 53 |
A |
| Pulsed Drain Current ^(2) |
I_DM |
242 |
A |
| Single Pulse Avalanche Energy ^(3) |
E_AS |
1600 |
mJ |
| Single Pulse Avalanche Current (L = 10mH) |
I_AS |
— |
A |
| Power Dissipation |
P_D |
T_A = 25°C: 481 |
W |
|
|
T_A = 100°C: 192 |
W |
| Junction & Storage Temperature Range |
T_J, T_STG |
-55 ~ +150 |
°C |
Thermal Characteristics
| Parameter |
Symbol |
Typ |
Max |
Unit |
| Thermal Resistance, Junction-to-Ambient ^(4) |
R_θJA |
28 |
35 |
°C/W |
| Thermal Resistance, Junction-to-Case ^(5) |
R_θJC |
0.22 |
0.26 |
°C/W |
Static Characteristics (@ T_J = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Drain-Source Breakdown Voltage |
V_(BR)DSS |
V_GS = 0V, I_D = 1mA |
600 |
— |
— |
V |
| Zero Gate Voltage Drain Current |
I_DSS |
V_DS = 600V, V_GS = 0V |
— |
— |
10.0 |
µA |
| Gate-Source Leakage Current |
I_GSS |
V_GS = ±20V, V_DS = 0V |
— |
— |
±100 |
nA |
| Gate Threshold Voltage |
V_GS(th) |
V_GS = V_DS, I_D = 1mA |
2.6 |
3.7 |
5.6 |
V |
| Static Drain-Source On-Resistance |
R_DS(on) |
V_GS = 10V, I_D = 25A |
— |
33.5 |
40 |
mΩ |
| Gate Resistance |
R_g |
V_GS = 0V, V_DS = 0V, f = 1MHz |
— |
1.2 |
— |
Ω |
Dynamic Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Input Capacitance |
C_iss |
V_DS = 400V, V_GS = 0V, f = 250kHz |
— |
4001 |
— |
pF |
| Output Capacitance |
C_oss |
|
— |
89 |
— |
pF |
| Reverse Transfer Capacitance |
C_rss |
|
— |
26 |
— |
pF |
| Effective Output Capacitance, Energy Related ^(8) |
C_o(er) |
V_GS = 0V, V_DS = 0...400V |
— |
168 |
— |
pF |
| Effective Output Capacitance, Time Related ^(9) |
C_o(tr) |
V_DS = 0...400V |
— |
1450 |
— |
pF |
Switching Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Turn-On Delay Time |
t_d(on) |
V_GS = 10V, V_DS = 400V |
— |
41 |
— |
ns |
| Rise Time |
t_r |
I_D = 15.6A, R_GEN = 3.6Ω |
— |
10 |
— |
ns |
| Turn-Off Delay Time |
t_d(off) |
|
— |
34 |
— |
ns |
| Fall Time |
t_f |
|
— |
11 |
— |
ns |
Gate Charge Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Total Gate Charge |
Q_g |
V_DS = 400V, I_D = 15.6A |
— |
140 |
— |
nC |
| Gate-Source Charge |
Q_gs |
|
— |
23 |
— |
nC |
| Gate-Drain Charge |
Q_gd |
V_GS = 0 to 10V |
— |
75 |
— |
nC |
| Gate Plateau Voltage |
V_plateau |
|
— |
5.9 |
— |
V |
Reverse Diode Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Diodes Forward Voltage |
V_SD |
I_F = 25A, V_GS = 0V |
— |
0.96 |
1.5 |
V |
| Body Diode Reverse Recovery Time |
t_rr |
I_S = 15.6A, di/dt = 100A/µs, V_DS = 400V |
— |
137 |
— |
ns |
| Body Diode Reverse Recovery Charge |
Q_rr |
|
— |
6.62 |
— |
µC |
| Diode Forward Current |
I_RM |
|
— |
10 |
— |
A |
| Diode dv/dt |
dv/dt |
V_R = 400V, I_F = 30A, di/dt = 200A/µs |
— |
124 |
— |
V/µs |
Notes:
- This current is chip limited, which is calculated based on RθJC.
- This current is calculated on single pulse with 10µs Pulse & Duty Cycle = 1%.
- Single Pulse Avalanche Energy (L = 10mH).
- Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
- Thermal resistance from junction to soldering point (on the exposed drain pad).
- Short duration pulse test used to minimize self-heating effect.
- Defined by design; not subject to production.
