Specifications
- Automotive (Y/N)
- N
- Package
- TO263-3L
- Configuration
- N
- Tj
- 150 °C
- VDS_Max
- 650 V
- ID_Max
- 19 A
- VGS(th)_Typ
- 3.8 V
- RDS(ON)_Typ @VGS=10V
- 152 mΩ
- RDS(ON)_Max @VGS=10V
- 190 mΩ
- VGS_Max
- ±30 V
- EAS_Max
- 210 mJ
- Ciss_Typ
- 1110 pF
- Coss_Typ
- 65 pF
- Crss_Typ
- 0.8 pF
- Qg_Typ
- 36 nC
Package & Schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SMJ65R190CFT
650V Super Junction N-Channel Power MOSFET
Product Summary
| V_DS |
R_DS(ON), max |
I_D, max |
| 650 V |
190 mΩ @ V_GS = 10V |
19 A |
TO263-3L
Features
- Low On-Resistance
- Fast Switching Capability
- 100% ∆V/DS & UIS & R_G Tested
- RoHS compliant, HALOGEN FREE
Applications
- LED Lighting
- Charger and Adapter
- PC and Telecom Power
Mechanical Data
- Green Molding Compound
- Moisture Sensitivity: Level 3 per J-STD-020
- UL Flammability Classification Rating 94V-0
Ordering Information
| Orderable Part Number |
Package Type |
Device Marking |
Form |
Quantity (pcs) |
| SMJ65R190CFT |
TO263-3L |
65R190CF |
13'' Tape&Reel |
800 |
Maximum Ratings (@ T_C = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Value |
Unit |
| Drain - Source Voltage |
V_DS |
650 |
V |
| Gate - Source Voltage |
V_GS |
±30 |
V |
| Continuous Drain Current (V_GS = 10V) ^(1) |
I_D |
T_C = 25°C: 19 |
A |
|
|
T_C = 100°C: 12 |
A |
| Pulsed Drain Current ^(2) |
I_DM |
78 |
A |
| Single Pulse Avalanche Energy ^(3) |
E_AS |
210 |
mJ |
| Single Pulse Avalanche Current (L = 10.0mH) |
I_AS |
7.7 |
A |
| Power Dissipation |
P_D |
T_C = 25°C: 169 |
W |
|
|
T_C = 100°C: 67.6 |
W |
| MOSFET dv/dt Ruggedness, V_DS = 0...400V |
dv/dt |
50 |
V/ns |
| Reverse Diodes dv/dt, V_DS = 0...400V, I_SD ≤ I_D |
dv/dt |
50 |
V/ns |
| Junction & Storage Temperature Range |
T_J, T_STG |
-55 ~ +150 |
°C |
Thermal Characteristics
| Parameter |
Symbol |
Typ |
Max |
Unit |
| Thermal Resistance, Junction-to-Ambient ^(4) |
R_θJA |
52 |
65 |
°C/W |
| Thermal Resistance, Junction-to-Case ^(5) |
R_θJC |
0.53 |
0.74 |
°C/W |
Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)
Off Characteristics ^(6)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Drain-Source Breakdown Voltage |
V_(BR)DSS |
V_GS = 0V, I_D = 250µA |
650 |
— |
— |
V |
| Zero Gate Voltage Drain Current |
I_DSS |
V_DS = 650V, V_GS = 0V |
— |
— |
5.0 |
µA |
|
|
T_J = 125°C |
— |
500 |
— |
µA |
| Gate-Source Leakage Current |
I_GSS |
V_GS = ±30V, V_DS = 0V |
— |
— |
±100 |
nA |
On Characteristics ^(6)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Gate Threshold Voltage |
V_GS(th) |
V_DS = V_GS, I_D = 250µA |
3.2 |
3.8 |
4.6 |
V |
| Static Drain-Source On-Resistance |
R_DS(on) |
V_GS = 10V, I_D = 10A |
— |
152 |
190 |
mΩ |
| Diodes Forward Voltage |
V_SD |
I_S = 10A, V_GS = 0V |
— |
0.90 |
1.1 |
V |
Dynamic Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Input Capacitance |
C_iss |
V_DS = 400V, V_GS = 0V, f = 1MHz |
— |
1110 |
— |
pF |
| Output Capacitance |
C_oss |
|
— |
65 |
— |
pF |
| Reverse Transfer Capacitance |
C_rss |
|
— |
0.8 |
— |
pF |
| Gate Resistance |
R_g |
V_GS = 0V, V_DS = 0V, f = 1MHz |
— |
13.0 |
— |
Ω |
Switching Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Turn-On Delay Time |
t_d(on) |
V_GS = 10V, V_DS = 400V |
— |
46 |
— |
ns |
| Rise Time |
t_r |
I_D = 17A, R_GEN = 27Ω |
— |
61 |
— |
ns |
| Turn-Off Delay Time |
t_d(off) |
|
— |
120 |
— |
ns |
| Fall Time |
t_f |
|
— |
34 |
— |
ns |
Gate Charge Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Total Gate Charge (V_GS = 10V) |
Q_g |
V_DS = 480V, I_D = 10A, V_GS = 10V |
— |
36 |
— |
nC |
| Total Gate Charge (V_GS = 8.0V) |
Q_g |
|
— |
32 |
— |
nC |
| Gate-Source Charge |
Q_gs |
|
— |
10 |
— |
nC |
| Gate-Drain Charge |
Q_gd |
|
— |
20 |
— |
nC |
| Gate Plateau Voltage |
V_plateau |
|
— |
7.7 |
— |
V |
Drain-Source Diode Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Body Diode Reverse Recovery Time |
t_rr |
I_S = 17A, di/dt = 100A/µs, T_J = 25°C |
— |
95 |
— |
ns |
| Body Diode Reverse Recovery Charge |
Q_rr |
|
— |
0.3 |
— |
µC |
| Diode Forward Current |
I_S |
T_C = 25°C |
— |
— |
19 |
A |
Notes:
- This current is chip limited, which is calculated based on RθJC.
- This current is calculated on single pulse with 10µs Pulse & Duty Cycle = 1%.
- Defined by design, not subject to production test. T_J=25°C, V_DD=400V, V_GS=10V, L=50mH.
- Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
- Thermal resistance from junction to the exposed pad.
- Short duration pulse test used to minimize self-heating effect.
- Defined by design; not subject to production.
