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SiC Modules
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Applications
SiC modules package silicon-carbide power devices together, combining the low-loss, high-frequency properties of SiC with the power density of modular packaging — used in PV inverters and energy-storage converters requiring high efficiency.
- Topology and rated current must match the end circuit architecture and power tier
- Module package parasitic inductance matters more given SiC's fast switching sensitivity
- Thermal design should consider whether the system can actually use SiC's higher junction-temperature capability
- The drive circuit must supply the high di/dt, dv/dt drive capability SiC devices require
AI Selection Assistant · SiC Modules
TrialGRECON
- Vces (V)
- 1200
- IC (A)
- 120
- RDS(on) @Tj=25°C max (mΩ)
- 13
- Circuit
- Half Bridge
- Package
- A2.0
- Rth(J-C) (K/W)
- 0.135
GRECON
- Vces (V)
- 1200
- IC (A)
- 300
- RDS(on) @Tj=25°C max (mΩ)
- 4.2
- Circuit
- Half Bridge
- Package
- A2.0
- Rth(J-C) (K/W)
- 0.073
GRECON
- Vces (V)
- 1200
- IC (A)
- 300
- RDS(on) @Tj=25°C max (mΩ)
- 6.7
- Circuit
- Half Bridge
- Package
- H1.0
- Rth(J-C) (K/W)
- 0.073
GRECON
- Vces (V)
- 1200
- IC (A)
- 400
- RDS(on) @Tj=25°C max (mΩ)
- 4
- Circuit
- Half Bridge
- Package
- A2.0
- Rth(J-C) (K/W)
- 0.063
GRECON
- Vces (V)
- 1200
- IC (A)
- 400
- RDS(on) @Tj=25°C max (mΩ)
- 5.5
- Circuit
- Half Bridge
- Package
- H1.0
- Rth(J-C) (K/W)
- 0.063
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- -
- Circuit
- -
- Package
- TO-247PLUS
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- -
- Circuit
- -
- Package
- TO-247PLUS
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 2.2
- Circuit
- -
- Package
- HPD
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 2.2
- Circuit
- -
- Package
- DCSi
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 2.2
- Circuit
- -
- Package
- Easy 2B
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 2.2
- Circuit
- -
- Package
- TPAK
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 2.2
- Circuit
- -
- Package
- DCM
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 5.5
- Circuit
- -
- Package
- HPD
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 5.5
- Circuit
- -
- Package
- TPAK
- Rth(J-C) (K/W)
- -
GRECON
- Vces (V)
- 1200
- IC (A)
- -
- RDS(on) @Tj=25°C max (mΩ)
- 5.5
- Circuit
- -
- Package
- DCM
- Rth(J-C) (K/W)
- -
| Brand | |||||||
|---|---|---|---|---|---|---|---|
| GRECON | 1200 | 120 | 13 | Half Bridge | A2.0 | 0.135 | |
| GRECON | 1200 | 300 | 4.2 | Half Bridge | A2.0 | 0.073 | |
| GRECON | 1200 | 300 | 6.7 | Half Bridge | H1.0 | 0.073 | |
| GRECON | 1200 | 400 | 4 | Half Bridge | A2.0 | 0.063 | |
| GRECON | 1200 | 400 | 5.5 | Half Bridge | H1.0 | 0.063 | |
| GRECON | 1200 | - | - | - | TO-247PLUS | - | |
| GRECON | 1200 | - | - | - | TO-247PLUS | - | |
| GRECON | - | - | - | - | - | - | |
| GRECON | 1200 | - | 2.2 | - | HPD | - | |
| GRECON | 1200 | - | 2.2 | - | DCSi | - | |
| GRECON | 1200 | - | 2.2 | - | Easy 2B | - | |
| GRECON | 1200 | - | 2.2 | - | - | - | |
| GRECON | 1200 | - | 2.2 | - | TPAK | - | |
| GRECON | 1200 | - | 2.2 | - | DCM | - | |
| GRECON | - | - | - | - | - | - | |
| GRECON | - | - | - | - | - | - | |
| GRECON | 1200 | - | 5.5 | - | HPD | - | |
| GRECON | 1200 | - | 5.5 | - | - | - | |
| GRECON | 1200 | - | 5.5 | - | TPAK | - | |
| GRECON | 1200 | - | 5.5 | - | DCM | - | |
| GRECON | - | - | - | - | - | - |
