The 2026 China Automotive Chip Supply Handbook was officially released at the 2026 IC (Wuxi) Innovation & Development Conference. Five SineSemi 40V automotive-grade SGT products were included in the handbook.
Five SineSemi products included in the 2026 China Automotive Chip Supply Handbook. Image: SineSemi
The 2026 China Automotive Chip Supply Handbook was guided by relevant national ministries and organized by the China Automotive Chip Industry Innovation Strategic Alliance, with nearly one hundred alliance chip-design companies taking part in its compilation. It is intended to connect automotive-chip supply and demand and accelerate the in-vehicle adoption of domestic chips.
United Nova Technology (UNT), a domestic power wafer fab, is a strategic shareholder of SineSemi, with 8-inch/12-inch wafer capacity and IATF 16949 and VDA 6.3 certification.
The five automotive-grade SGT products included in the handbook. Image: SineSemi
All five included products are 40V automotive-grade SGT devices in PDFN5060-series packages:
| Part number | Type | RDS(on) | Current | Package | Typical use |
|---|---|---|---|---|---|
| SMT400SAHPWQ | N-channel SGT | 0.7 mΩ | 333 A | PDFN5060-8L-W | EPS, 12V BMS |
| SMT4001AHPWQ | N-channel SGT | 1.2 mΩ | 226 A | PDFN5060-8L-W | Mid-power water/oil pumps, cooling fans, EPB |
| SMT4004AHPHQ | Half-bridge power SGT | 3.6 mΩ | 79 A | PDFN5060-8L-HW | Seats, electronic door locks, electronic valves |
| SMT4005AHPQ | N-channel SGT | 3.9 mΩ | 92 A | PDFN5060-8L | Reverse-battery protection, seat motors |
| SMT4005AHPDQ | Dual SGT | 4.6 mΩ | 68 A | PDFN5060-8L-D | Low-power water pumps, power tailgate, sunroof |
The SineSemi automotive-grade SGT platform features an SGT (shielded-gate trench) process that lowers on-resistance and Miller gate charge; an optimized figure of merit (FOM) for higher system efficiency; automotive-grade process control with consistent parameters and stable mass-production yield; a high-reliability redundancy design aimed at automotive safety; Spice Model support to catch design flaws early; copper clip-bridge technology for better heat dissipation with ultra-thin wafer packaging capability; a Wettable Flank plus long-lead design suited to the long-term vibration conditions of automotive electronics; and automotive reliability corresponding to AEC-Q101 qualification (see the badge in the image).
Vehicle domains covered by SineSemi automotive-grade SGT products (ADAS / infotainment / powertrain / body comfort / chassis safety). Image: SineSemi
SineSemi will continue to focus on innovation in its SGT technology platform and deepen cooperation with industry-chain partners, providing power-semiconductor devices for the core systems of new-energy and intelligent vehicles.
Source: SineSemi company news · www.sinesemi.com/gsxw/4286.html