SCD4A65BU2 产品图

产品详情

SCD4A65BU2

中晶新源 SineSemi核心代理商

SiC SBDTO252-2L
规格书下载

参数规格

车规 (Y/N)
N
封装
TO252-2L
结温 Tj
175 °C
反向重复峰值电压 VRRM
650 V
正向电流 IF
4 A
电容电荷 Qc 典型
9.5 nC
结电容 C
185 pF
电容储能 Ec
2.4 mJ
最小包装量
2500 pcs
最小订购量
25000 pcs

封装与电路符号

SCD4A65BU2 封装外形、引脚配置与电路符号图
封装外形 · 引脚配置 · 电路符号(源自中晶新源官方 datasheet)

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SCD4A65BU2

650V SiC Schottky Diode

Product Summary
V_RRM I_F T_J,max Q_c
650 V 4.8 A 175°C 9.5 nC

TO252-2L

Maximum Ratings (@ T_C = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Repetitive Peak Reverse Voltage V_RRM 650 V
Surge Peak Reverse Voltage V_RSM 650 V
DC Blocking Voltage V_DC 650 V
Continuous Forward Current (T_C = 150°C) I_F 4.8 A
Repetitive Peak Forward Surge Current (T_C = 25°C, tp=10ms, Half Sine Wave) I_FRM 20 A
Non-Repetitive Peak Forward Surge Current (T_C = 25°C, tp=10ms, Half Sine Wave) I_FSM 26 A
Non-Repetitive Peak Forward Surge Current (T_C = 25°C, tp=10s, Pulse) I_F,Max 200 A
I²t value (T_C = 25°C, tp=10ms) I²t 3.3 A²s
Power Dissipation (T_C = 25°C) P_tot 76.5 W
Power Dissipation (T_C = 110°C) P_tot 33.2 W
Junction & Storage Temperature Range T_J, T_STG -55 ~ +175 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Case R_θJC 1.96 °C/W

Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)

Parameter Symbol Test Condition Min Typ Max Units
Forward Voltage V_F I_F = 4.0A, T_J = 25°C 1.5 1.8 V
I_F = 4.0A, T_J = 175°C 1.8 2.0 V
Reverse Current I_R V_R = 650V, T_J = 25°C 1.0 20 µA
V_R = 650V, T_J = 175°C 12 100 µA
Total Capacitive Charge Q_C V_R = 400V, T_J = 25°C 9.5 nC
Total Capacitance C V_R = 0V, T_J = 25°C, f = 1MHz 185 pF
V_R = 200V, T_J = 25°C, f = 1MHz 19.0 pF
V_R = 400V, T_J = 25°C, f = 1MHz 16.7 pF
Capacitance Stored Energy E_C V_R = 400V 2.4 µJ