SMT6012ALAE 产品图

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SMT6012ALAE

中晶新源 SineSemi核心代理商

晶圆/裸片Wafer

参数规格

工艺
SGT
结构
N
漏源电压 VDS
60 V
导通电阻 RDS(ON)@10V 最大
10 mΩ
导通电阻 RDS(ON)@10V 典型
8.5 mΩ
阈值电压 VGS(th) 典型
1.7 V
With ESD
No
Die Size (mm²)
1580*1000
Gross Die (8" wafer)
18024
Wafer Thickness (mm)
150±15
栅源电压 VGS 最大
±20 V
导通电阻 RDS(ON)@4.5V 典型
11.6 mΩ
导通电阻 RDS(ON)@4.5V 最大
14.4 mΩ
输入电容 Ciss 典型
594 pF
输出电容 Coss 典型
301 pF
反向传输电容 Crss 典型
21 pF
总栅极电荷 Qg 典型
11.6 nC
Qgs_Typ
1.84 nC
Qgd_Typ
2.65 nC

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SMT6012ALAE

60V N-Channel Power MOSFET

Product Summary
  • V_DS = 60V
  • R_DS(ON), max = 8.3mΩ (V_GS = 10V)
  • R_DS(ON), max = 11.5mΩ (V_GS = 4.5V)
Potential Applications
  • Load Switching
  • Motor Driver
  • High frequency switching synchronous rectification
Chip Information
Parameter Value
Die Size (with scribe line) 1580µm × 1000µm
Gate Pad Size 160µm × 160µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 150µm ± 15µm
Wafer Diameter 8 inch
Polyimide Yes
Front Metal Composition & Thickness AlCu, 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.3µm
Gross Die (approximately) 16,024
Ordering Information
Orderable Part Number Wafer Description
SMT6012ALAE Sampling Tested Wafer
SMT6012ALAE-C Full CP Tested Wafer
Maximum Ratings (@ T_J = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage V_DS 60 V
Gate - Source Voltage V_GS ±20 V
Junction Temperature Range T_J -55 ~ +175 °C

Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)

Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V_(BR)DSS V_GS = 0V, I_D = 250µA 60 V
Zero Gate Voltage Drain Current I_DSS V_DS = 60V, V_GS = 0V 1.0 µA
Gate-Body Leakage Current I_GSS V_GS = ±20V, V_DS = 0V ±100 nA
Gate Threshold Voltage V_GS(th) V_GS = V_DS, I_D = 250µA 1.2 1.7 2.6 V
Static Drain-Source On-Resistance ^(1) R_DS(on) V_GS = 10V, I_D = 10A 8.3 10.6
V_GS = 4.5V, I_D = 15A 11.5 14.4
Diodes Forward Voltage V_SD I_S = 2.0A, V_GS = 0V 0.7 1.0 V

Notes:

  1. R_DS(on) value is referred by the device assembled in PDFN5060-8L.