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IR Sensors

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IR sensors detect infrared radiation for non-contact sensing, used in human-presence detection, non-contact temperature measurement and security monitoring.

Detection wavelength range must match the target's infrared emission characteristics (human body vs. object)
Sensitivity and response speed determine detection range and ability to capture fast-moving targets
Field of view (FOV) and package optics affect detection coverage
Operating temperature range must cover the actual deployment environment, especially outdoor/industrial

Learn more: IR Sensors Selection Guide →

Filters

VDD

1.4V to 3.6V2.7V to 3.6V

IDD

3.0µA4.5µA~5mA＜5µA

Output Type

Package

DFN8L2X2-0.55, bare dieBare die

GCP1601PA

GRECON

VDD: -
IDD: -
Output Type: PIR Signal and on-chip temperature (Compatible to DOCI)
Package: -
Key Parameters: -
Types: -

GCP8601PA

GRECON

VDD: -
IDD: -
Output Type: Motion detection Supply voltage for PIR Detector
Package: -
Key Parameters: -
Types: -

GCP9401PA

GRECON

VDD: -
IDD: -
Output Type: Motion detection
Package: -
Key Parameters: -
Types: -

GCP9601PA

GRECON

VDD: -
IDD: -
Output Type: Motion detection,Presense detection，Occupancy Detection
Package: -
Key Parameters: -
Types: -

M1601

GRECON

VDD: 1.4V to 3.6V
IDD: 3.0µA
Output Type: Digital mode; outputs raw PIR signal and on-chip temperature; single-wire mode, DOCI-compatible
Package: DFN8L2X2-0.55, bare die
Key Parameters: Outputs raw PIR signal; ultra-low operating current, wide voltage range; fully digital signal processing with on-chip temperature sensor; self-test mode enables digital probe function testing
Types: ALL

M1801

GRECON

VDD: 1.4V to 3.6V
IDD: ＜5µA
Output Type: Raw thermopile signal; single-wire communication interface, DOCI-compatible
Package: DFN8L2X2-0.55, bare die
Key Parameters: Ultra-low operating current, wide voltage range, single-wire interface, DOCI-compatible; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 14 bits, accuracy up to 0.02K
Types: ALL

M2801

GRECON

VDD: 2.7V to 3.6V
IDD: ~5mA
Output Type: 1×8 array thermopile signal conditioning IC; I2C or SPI bus interface
Package: Bare die
Key Parameters: Built-in EEPROM, I2C or SPI bus interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
Types: ALL

M3801

GRECON

VDD: 1.4V to 3.6V
IDD: ＜5µA
Output Type: Raw thermopile signal, I2C bus interface
Package: DFN8L2X2-0.55, bare die
Key Parameters: Ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
Types: ALL

M3802

GRECON

VDD: 1.4V to 3.6V
IDD: ＜5µA
Output Type: Raw thermopile signal, I2C bus interface
Package: DFN8L2X2-0.55, bare die
Key Parameters: Built-in EEPROM, ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
Types: ALL

M4801

GRECON

VDD: 2.7V to 3.6V
IDD: ~5mA
Output Type: 1×32 array thermopile signal conditioning IC; I2C or SPI bus interface
Package: Bare die
Key Parameters: 1×32 array mode, built-in EEPROM, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
Types: ALL

M8601

GRECON

VDD: 1.4V to 3.6V
IDD: 3.0µA
Output Type: Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature
Package: DFN8L2X2-0.55, bare die
Key Parameters: Digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, with on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention
Types: ALL

M8602

GRECON

VDD: 1.4V to 3.6V
IDD: 3.0µA
Output Type: Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; I2C bus communication mode
Package: DFN8L2X2-0.55, bare die
Key Parameters: Built-in memory unit; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention
Types: ALL

M9401

GRECON

VDD: 1.4V to 3.6V
IDD: 4.5µA
Output Type: Human motion detection, I/O signal output; single-wire communication mode in test mode (DOCI-compatible)
Package: DFN8L2X2-0.55, bare die
Key Parameters: Wide voltage range, extremely low operating current; self-test mode enables digital probe function testing; motion-output pulse width adjustable in 128 steps
Types: ALL

M9601

GRECON

VDD: 1.4V to 3.6V
IDD: 3.0µA
Output Type: Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; single-wire communication mode, DOCI-compatible
Package: DFN8L2X2-0.55, bare die
Key Parameters: Single-wire configuration and data readout mode; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; single-wire communication interface, DOCI-compatible, with self-test mode; enables system false-alarm prevention
Types: ALL

	Brand
GCP1601PA	GRECON	-	-	PIR Signal and on-chip temperature (Compatible to DOCI)	-	-	-
GCP8601PA	GRECON	-	-	Motion detection Supply voltage for PIR Detector	-	-	-
GCP9401PA	GRECON	-	-	Motion detection	-	-	-
GCP9601PA	GRECON	-	-	Motion detection,Presense detection，Occupancy Detection	-	-	-
M1601	GRECON	1.4V to 3.6V	3.0µA	Digital mode; outputs raw PIR signal and on-chip temperature; single-wire mode, DOCI-compatible	DFN8L2X2-0.55, bare die	Outputs raw PIR signal; ultra-low operating current, wide voltage range; fully digital signal processing with on-chip temperature sensor; self-test mode enables digital probe function testing	ALL
M1801	GRECON	1.4V to 3.6V	＜5µA	Raw thermopile signal; single-wire communication interface, DOCI-compatible	DFN8L2X2-0.55, bare die	Ultra-low operating current, wide voltage range, single-wire interface, DOCI-compatible; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 14 bits, accuracy up to 0.02K	ALL
M2801	GRECON	2.7V to 3.6V	~5mA	1×8 array thermopile signal conditioning IC; I2C or SPI bus interface	Bare die	Built-in EEPROM, I2C or SPI bus interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K	ALL
M3801	GRECON	1.4V to 3.6V	＜5µA	Raw thermopile signal, I2C bus interface	DFN8L2X2-0.55, bare die	Ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K	ALL
M3802	GRECON	1.4V to 3.6V	＜5µA	Raw thermopile signal, I2C bus interface	DFN8L2X2-0.55, bare die	Built-in EEPROM, ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K	ALL
M4801	GRECON	2.7V to 3.6V	~5mA	1×32 array thermopile signal conditioning IC; I2C or SPI bus interface	Bare die	1×32 array mode, built-in EEPROM, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K	ALL
M8601	GRECON	1.4V to 3.6V	3.0µA	Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature	DFN8L2X2-0.55, bare die	Digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, with on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention	ALL
M8602	GRECON	1.4V to 3.6V	3.0µA	Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; I2C bus communication mode	DFN8L2X2-0.55, bare die	Built-in memory unit; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention	ALL
M9401	GRECON	1.4V to 3.6V	4.5µA	Human motion detection, I/O signal output; single-wire communication mode in test mode (DOCI-compatible)	DFN8L2X2-0.55, bare die	Wide voltage range, extremely low operating current; self-test mode enables digital probe function testing; motion-output pulse width adjustable in 128 steps	ALL
M9601	GRECON	1.4V to 3.6V	3.0µA	Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; single-wire communication mode, DOCI-compatible	DFN8L2X2-0.55, bare die	Single-wire configuration and data readout mode; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; single-wire communication interface, DOCI-compatible, with self-test mode; enables system false-alarm prevention	ALL