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IR Sensors
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IR sensors detect infrared radiation for non-contact sensing, used in human-presence detection, non-contact temperature measurement and security monitoring.
- Detection wavelength range must match the target's infrared emission characteristics (human body vs. object)
- Sensitivity and response speed determine detection range and ability to capture fast-moving targets
- Field of view (FOV) and package optics affect detection coverage
- Operating temperature range must cover the actual deployment environment, especially outdoor/industrial
GRECON
- VDD
- -
- IDD
- -
- Output
- PIR Signal and on-chip temperature (Compatible to DOCI)
- Package
- -
- Key Parameters
- -
- Types
- -
GRECON
- VDD
- -
- IDD
- -
- Output
- Motion detection Supply voltage for PIR Detector
- Package
- -
- Key Parameters
- -
- Types
- -
GRECON
- VDD
- -
- IDD
- -
- Output
- Motion detection,Presense detection,Occupancy Detection
- Package
- -
- Key Parameters
- -
- Types
- -
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- 3.0µA
- Output
- Digital mode; outputs raw PIR signal and on-chip temperature; single-wire mode, DOCI-compatible
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Outputs raw PIR signal; ultra-low operating current, wide voltage range; fully digital signal processing with on-chip temperature sensor; self-test mode enables digital probe function testing
- Types
- ALL
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- <5µA
- Output
- Raw thermopile signal; single-wire communication interface, DOCI-compatible
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Ultra-low operating current, wide voltage range, single-wire interface, DOCI-compatible; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 14 bits, accuracy up to 0.02K
- Types
- ALL
GRECON
- VDD
- 2.7V to 3.6V
- IDD
- ~5mA
- Output
- 1×8 array thermopile signal conditioning IC; I2C or SPI bus interface
- Package
- Bare die
- Key Parameters
- Built-in EEPROM, I2C or SPI bus interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
- Types
- ALL
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- <5µA
- Output
- Raw thermopile signal, I2C bus interface
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
- Types
- ALL
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- <5µA
- Output
- Raw thermopile signal, I2C bus interface
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Built-in EEPROM, ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
- Types
- ALL
GRECON
- VDD
- 2.7V to 3.6V
- IDD
- ~5mA
- Output
- 1×32 array thermopile signal conditioning IC; I2C or SPI bus interface
- Package
- Bare die
- Key Parameters
- 1×32 array mode, built-in EEPROM, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K
- Types
- ALL
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- 3.0µA
- Output
- Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, with on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention
- Types
- ALL
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- 3.0µA
- Output
- Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; I2C bus communication mode
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Built-in memory unit; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention
- Types
- ALL
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- 4.5µA
- Output
- Human motion detection, I/O signal output; single-wire communication mode in test mode (DOCI-compatible)
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Wide voltage range, extremely low operating current; self-test mode enables digital probe function testing; motion-output pulse width adjustable in 128 steps
- Types
- ALL
GRECON
- VDD
- 1.4V to 3.6V
- IDD
- 3.0µA
- Output
- Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; single-wire communication mode, DOCI-compatible
- Package
- DFN8L2X2-0.55, bare die
- Key Parameters
- Single-wire configuration and data readout mode; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; single-wire communication interface, DOCI-compatible, with self-test mode; enables system false-alarm prevention
- Types
- ALL
| Brand | |||||||
|---|---|---|---|---|---|---|---|
| GCP1601PA | GRECON | - | - | PIR Signal and on-chip temperature (Compatible to DOCI) | - | - | - |
| GCP8601PA | GRECON | - | - | Motion detection Supply voltage for PIR Detector | - | - | - |
| GCP9401PA | GRECON | - | - | Motion detection | - | - | - |
| GCP9601PA | GRECON | - | - | Motion detection,Presense detection,Occupancy Detection | - | - | - |
| M1601 | GRECON | 1.4V to 3.6V | 3.0µA | Digital mode; outputs raw PIR signal and on-chip temperature; single-wire mode, DOCI-compatible | DFN8L2X2-0.55, bare die | Outputs raw PIR signal; ultra-low operating current, wide voltage range; fully digital signal processing with on-chip temperature sensor; self-test mode enables digital probe function testing | ALL |
| M1801 | GRECON | 1.4V to 3.6V | <5µA | Raw thermopile signal; single-wire communication interface, DOCI-compatible | DFN8L2X2-0.55, bare die | Ultra-low operating current, wide voltage range, single-wire interface, DOCI-compatible; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 14 bits, accuracy up to 0.02K | ALL |
| M2801 | GRECON | 2.7V to 3.6V | ~5mA | 1×8 array thermopile signal conditioning IC; I2C or SPI bus interface | Bare die | Built-in EEPROM, I2C or SPI bus interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K | ALL |
| M3801 | GRECON | 1.4V to 3.6V | <5µA | Raw thermopile signal, I2C bus interface | DFN8L2X2-0.55, bare die | Ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K | ALL |
| M3802 | GRECON | 1.4V to 3.6V | <5µA | Raw thermopile signal, I2C bus interface | DFN8L2X2-0.55, bare die | Built-in EEPROM, ultra-low operating current, wide voltage range, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K | ALL |
| M4801 | GRECON | 2.7V to 3.6V | ~5mA | 1×32 array thermopile signal conditioning IC; I2C or SPI bus interface | Bare die | 1×32 array mode, built-in EEPROM, I2C bus communication interface; on-chip temperature sensor for temperature compensation; TPS signal resolution up to 17 bits, minimum 0.8µV/count; on-chip temperature sensor resolution up to 15 bits, accuracy up to 0.02K | ALL |
| M8601 | GRECON | 1.4V to 3.6V | 3.0µA | Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature | DFN8L2X2-0.55, bare die | Digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, with on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention | ALL |
| M8602 | GRECON | 1.4V to 3.6V | 3.0µA | Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; I2C bus communication mode | DFN8L2X2-0.55, bare die | Built-in memory unit; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; self-test mode enables digital probe function testing; enables system false-alarm prevention | ALL |
| M9401 | GRECON | 1.4V to 3.6V | 4.5µA | Human motion detection, I/O signal output; single-wire communication mode in test mode (DOCI-compatible) | DFN8L2X2-0.55, bare die | Wide voltage range, extremely low operating current; self-test mode enables digital probe function testing; motion-output pulse width adjustable in 128 steps | ALL |
| M9601 | GRECON | 1.4V to 3.6V | 3.0µA | Human motion detection, I/O signal output; or digital mode, outputting raw PIR signal and on-chip temperature; single-wire communication mode, DOCI-compatible | DFN8L2X2-0.55, bare die | Single-wire configuration and data readout mode; digitally programmable for motion detection or digital mode; ultra-low operating current, wide voltage range, on-chip temperature sensor; single-wire communication interface, DOCI-compatible, with self-test mode; enables system false-alarm prevention | ALL |
