SMT400SAHAD product image

Product Detail

SMT400SAHAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
0.5 mΩ
RDS(ON)_Typ @VGS=10V
0.43 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (mm²)
6300*4580
Gross Die (8" wafer)
909
Wafer Thickness (mm)
105±10
VGS_Max
±20 V
Ciss_Typ
14999 pF
Coss_Typ
8191 pF
Crss_Typ
320 pF
Qg_Typ
194 nC
Qgs_Typ
68 nC
Qgd_Typ
31 nC