SMT15T05AHPC product image

Product Detail

SMT15T05AHPC

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
150 V
RDS(ON)_Max @VGS=10V
5.8 mΩ
RDS(ON)_Typ @VGS=10V
4.8 mΩ
VGS(th)_Typ
3.4 V
With ESD
No
Die Size (mm²)
4140*3600
Gross Die (8" wafer)
1856
Wafer Thickness (mm)
90±10
VGS_Max
±20 V