Product Detail
SMT4001BLPA
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 40 V
- RDS(ON)_Max @VGS=10V
- 1.05 mΩ
- RDS(ON)_Typ @VGS=10V
- 0.87 mΩ
- VGS(th)_Typ
- 1.7 V
- With ESD
- No
- Die Size (mm²)
- 2850*2250
- Gross Die (8" wafer)
- 4282
- Wafer Thickness (mm)
- 60±10
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 1.3 mΩ
- RDS(ON)_Max @VGS=4.5V
- 1.6 mΩ
- Ciss_Typ
- 2969 pF
- Coss_Typ
- 1473 pF
- Crss_Typ
- 94 pF
- Qg_Typ
- 46 nC
- Qgs_Typ
- 7.4 nC
- Qgd_Typ
- 6.2 nC