Product Detail
SMN6030ALAE
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- Trench
- Configuration
- N
- VDS_Max
- 60 V
- RDS(ON)_Max @VGS=10V
- 30 mΩ
- RDS(ON)_Typ @VGS=10V
- 23 mΩ
- VGS(th)_Typ
- 1.3 V
- With ESD
- No
- Die Size (mm²)
- 1450*1080
- Gross Die (8" wafer)
- 18500
- Wafer Thickness (mm)
- 150±15
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 26 mΩ
- RDS(ON)_Max @VGS=4.5V
- 40 mΩ
- Ciss_Typ
- 1038 pF
- Coss_Typ
- 68 pF
- Crss_Typ
- 57 pF
- Qg_Typ
- 22 nC
- Qgs_Typ
- 2.1 nC
- Qgd_Typ
- 3.5 nC