SMT12T01AHAF2 product image

Product Detail

SMT12T01AHAF2

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
120 V
RDS(ON)_Max @VGS=10V
1.7 mΩ
RDS(ON)_Typ @VGS=10V
1.4 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (mm²)
6600*5050
Gross Die (8" wafer)
805
Wafer Thickness (mm)
200±20
VGS_Max
±20 V
Ciss_Typ
12205 pF
Coss_Typ
2542 pF
Crss_Typ
69 pF
Qg_Typ
156 nC
Qgs_Typ
54 nC
Qgd_Typ
29 nC