SMT4005AHAD 产品图

产品详情

SMT4005AHAD

中晶新源 SineSemi核心代理商

晶圆/裸片Wafer

参数规格

工艺
SGT
结构
N
漏源电压 VDS
40 V
导通电阻 RDS(ON)@10V 最大
4.7 mΩ
导通电阻 RDS(ON)@10V 典型
3.9 mΩ
阈值电压 VGS(th) 典型
3 V
With ESD
No
Die Size (mm²)
1800*1220
Gross Die (8" wafer)
12492
Wafer Thickness (mm)
105±10
栅源电压 VGS 最大
±20 V
输入电容 Ciss 典型
982 pF
输出电容 Coss 典型
593 pF
反向传输电容 Crss 典型
25 pF
总栅极电荷 Qg 典型
14 nC
Qgs_Typ
4.6 nC
Qgd_Typ
2.9 nC

在线规格书

以下内容整理自原厂规格书,实际参数以原厂正式文件为准。

SMT4005AHAD

40V N-Channel Power MOSFET (Wafer Datasheet)

Product Summary
  • V_DS = 40V
  • R_DS(ON), max = 3.9mΩ (V_GS = 10V)
Chip Information
Parameter Value
Die Size (with scribe line) 1800µm × 1220µm
Gate Pad Size 155µm × 155µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 100µm ± 10µm
Wafer Diameter 8 inch
Passivation Yes
Front Metal Composition & Thickness AlCu, 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.3µm
Gross Die (approximately) 12,663
Recommended Package PDFN5060-8L
Ordering Information
Orderable Part Number Wafer Description
SMT4005AHAD Sampling Tested Wafer
SMT4005AHAD-C Full CP Tested Wafer
Maximum Ratings (@ T_J = 25°C)
Parameter Symbol Value Units
V_DS V_DS 40 V
V_GS V_GS ±20 V
T_J T_J -55 ~ +175 °C
Electrical Characteristics (@ T_J = 25°C)
Parameter Symbol Test Conditions Min Typ Max Units
V_(BR)DSS V_(BR)DSS V_GS = 0V, I_D = 250µA 40 V
I_DSS I_DSS V_DS = 40V 1.0 µA
I_GSS I_GSS V_GS = ±20V ±100 nA
V_GS(th) V_GS(th) I_D = 250µA 2.0 3.0 4.0 V
R_DS(ON) ^(1) R_DS(ON) V_GS = 10V, I_D = 20A 3.9 4.7
V_SD V_SD I_S = 2A 0.7 1.2 V
Dynamic Characteristics

C_iss=882pF, C_oss=693pF, C_rss=25pF, R_g=4.2Ω

Gate Charge Characteristics

Q_g=14nC, Q_gs=4.4nC (V_DS=20V, I_D=20A), Q_gd=2.9nC, V_plateau=5.2V

Drain-Source Diode Characteristics

t_rr=30ns, Q_rr=13nC (I_S=20A, di/dt=100A/µs)

Notes:

  1. R_DS(ON) value is referred by the device assembled in PDFN5060-8L.