SMT15T04AHTL 产品图

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SMT15T04AHTL

中晶新源 SineSemi核心代理商

中低压 MOSFETTOLL
规格书下载

参数规格

封装
TOLL
结构
N
漏源电压 VDS
150 V
漏极电流 ID
240 A
导通电阻 RDS(ON)@10V 最大
4.1 mΩ
车规 (Y/N)
N
阈值电压 VGS(th) 典型
3.4 V
导通电阻 RDS(ON)@10V 典型
3.4 mΩ
栅源电压 VGS 最大
±20 V
结温 Tj
175 °C
雪崩能量 EAS 最大
1796 mJ
输入电容 Ciss 典型
6238 pF
输出电容 Coss 典型
783 pF
反向传输电容 Crss 典型
23 pF
总栅极电荷 Qg 典型
91 nC
ESD
No
最小包装量
2000 pcs
最小订购量
20000 pcs
应用推荐-马达驱动
Y
应用推荐-高频电源
Y
应用推荐-锂电池保护
Y
应用推荐-通用开关
Y

不确定怎么选？阅读《中低压 MOSFET 选型指南》 →

封装与电路符号

SMT15T04AHTL 封装外形、引脚配置与电路符号图
封装外形 · 引脚配置 · 电路符号（源自中晶新源官方 datasheet）

在线规格书

以下内容整理自原厂规格书，实际参数以原厂正式文件为准。

SMT15T04AHTL

150V N-Channel Power MOSFET

Product Summary
VDS RDS(ON), max ID, max
150 V 4.1 mΩ @ VGS = 10V 240 A

TOLL

Features
  • Low On-Resistance
  • Excellent FoM (figure of merit)
  • 100% ∆VDS & UIS & Rg Tested
  • RoHS compliant, HALOGEN FREE
Ordering Information
Orderable Part Number Package Type Device Marking Form Quantity (pcs)
SMT15T04AHTL TOLL 15T04AH 13" Tape&Reel 2,000
Maximum Ratings (@ TA = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage VDS 150 V
Gate - Source Voltage VGS ±20 V
Continuous Drain Current (VGS = 10V) (1) ID TA = 25°C: 240 A
TA = 100°C: 162 A
Pulsed Drain Current (2) IDM 777 A
Single Pulse Avalanche Energy (3) EAS 1798 mJ
Single Pulse Avalanche Current (L = 0.1mH) IAS 110 A
Power Dissipation PD TA = 25°C: 500 W
TA = 100°C: 250 W
Junction & Storage Temperature Range TJ, TSTG -55 ~ +175 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient (4) R_θJA 20 25 °C/W
Thermal Resistance, Junction-to-Case (5) R_θJC 0.23 0.30 °C/W

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Off Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 150 — — V
Zero Gate Voltage Drain Current IDSS VDS = 150V, VGS = 0V — — 1.0 µA
TJ = 125°C — — 100 µA
Gate-Source Leakage Current IGSS VGS = ±20V, VDS = 0V — — ±100 nA
On Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 2.5 3.4 4.5 V
Static Drain-Source On-Resistance RDS(on) VGS = 10V, ID = 20A — 3.4 4.1 mΩ
Forward Transconductance gfs VDS = 5.0V, ID = 20A — 58 — S
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V — 0.7 1.2 V
Dynamic Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Input Capacitance Ciss VDS = 75V, VGS = 0V, f = 1MHz — 6238 — pF
Output Capacitance Coss — 783 — pF
Reverse Transfer Capacitance Crss — 23 — pF
Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz — 2.2 — Ω
Switching Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Turn-On Delay Time td(on) VGS = 10V, VDS = 75V — 20 — ns
Rise Time tr ID = 20A, RGEN = 3.0Ω — 41 — ns
Turn-Off Delay Time td(off) — 58 — ns
Fall Time tf — 44 — ns
Gate Charge Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Total Gate Charge (VGS = 10V) Qg VDS = 75V, ID = 20A — 91 — nC
Total Gate Charge (VGS = 6.0V) Qg — 59 — nC
Gate-Source Charge Qgs VGS = 10V — 26 — nC
Gate-Drain Charge Qgd — 21 — nC
Gate Plateau Voltage Vplateau — 4.5 — V
Drain-Source Diode Characteristics (7)
Parameter Symbol Test Condition Min Typ Max Unit
Body Diode Reverse Recovery Time trr IS = 20A, di/dt = 100A/µs — 103 — ns
Body Diode Reverse Recovery Charge Qrr TJ = 25°C — 431 — nC
Diode Forward Current IS TA = 25°C — — 240 A

Notes:

  1. This current is chip limited, which is calculated based on RθJC.
  2. This current is calculated on single pulse with 10µs Pulse & Duty Cycle = 1%.
  3. Defined by design, not subject to production test. EAS condition, TJ=25°C, VDS=75V, VGS=10V, L=1.0mH.
  4. Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
  5. Thermal resistance from junction to soldering point (on the exposed drain pad).
  6. Short duration pulse test used to minimize self-heating effect.
  7. Defined by design; not subject to production.
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