Specifications
- Package
- PDFN5060-8L
- Configuration
- P
- VDS_Max
- -60 V
- ID
- -25 A
- RDS(ON)_Max @VGS=10V
- 50 mΩ
- Automotive (Y/N)
- Y
- VGS(th)_Typ
- -1.8 V
- RDS(ON)_Typ @VGS=10V
- 37 mΩ
- RDS(ON)_Typ @VGS=4.5V
- 50 mΩ
- RDS(ON)_Max @VGS=4.5V
- 65 mΩ
- VGS_Max
- ±20 V
- Tj
- 175 °C
- EAS_Max
- 68 mJ
- Ciss_Typ
- 668 pF
- Coss_Typ
- 222 pF
- Crss_Typ
- 12 pF
- Qg_Typ
- 11.8 nC
- ESD
- No
- MPQ
- 5000 pcs
- MOQ
- 50000 pcs
- App: Motor Drive
- Y
- App: HF Power
- Y
- App: General Switch
- Y
Package & Schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SMP6050ALPQ
-60V P-Channel Enhancement Mode Power MOSFET
Sinesemi Automotive MOSFET — AEC-Q101 Qualified, PPAP Capable, 175°C Operating Temperature
Product Summary
| V_DS |
R_DS(ON), max |
I_D, max |
| -60 V |
50 mΩ @ V_GS = -10V |
-25 A |
|
65 mΩ @ V_GS = -4.5V |
|
PDFN5060-8L
Features
- P-Channel Enhancement Mode - Logic Level
- AEC-Q101 Qualified, PPAP Capable
- 175°C Operating Temperature
- 100% UIS and Rg Tested
Application
- General Automotive Applications
Ordering Information
| Orderable Part Number |
Package Type |
Device Marking |
Form |
Quantity (pcs) |
| SMP6050ALPQ PDFN5060-8L P6050ALQ 13'' Tape&Reel 5,000 |
— |
— |
— |
— |
Maximum Ratings (@ T_C = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Value |
Unit |
| Drain - Source Voltage |
V_DS |
-60 |
V |
| Gate - Source Voltage |
V_GS |
±20 |
V |
| Continuous Drain Current (V_GS = -10V) ^(1) |
I_D |
T_C = 25°C: -25 |
A |
|
|
T_C = 100°C: -17.7 |
A |
| Pulsed Drain Current ^(2) |
I_DM |
-100 |
A |
| Single Pulse Avalanche Energy ^(3) |
E_AS |
68 |
mJ |
| Single Pulse Avalanche Current (L = 0.1mH) |
I_AS |
-21 |
A |
| Power Dissipation |
P_D |
T_C = 25°C: 52 |
W |
|
|
T_C = 100°C: 26 |
W |
| Junction & Storage Temperature Range |
T_J, T_STG |
-55 ~ +175 |
°C |
Thermal Characteristics
| Parameter |
Symbol |
Typ |
Max |
Unit |
| Thermal Resistance, Junction-to-Ambient ^(4) |
R_θJA |
45 |
56 |
°C/W |
| Thermal Resistance, Junction-to-Case ^(5) |
R_θJC |
2.2 |
2.9 |
°C/W |
Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)
Off Characteristics ^(6)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Drain-Source Breakdown Voltage |
V_(BR)DSS |
V_GS = 0V, I_D = -250µA |
-60 |
— |
— |
V |
| Zero Gate Voltage Drain Current |
I_DSS |
V_DS = -60V, V_GS = 0V |
— |
— |
-1.0 |
µA |
|
|
T_J = 125°C |
— |
— |
-100 |
µA |
| Gate-Source Leakage Current |
I_GSS |
V_GS = ±20V, V_DS = 0V |
— |
— |
±100 |
nA |
On Characteristics ^(6)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Gate Threshold Voltage |
V_GS(th) |
V_DS = V_GS, I_D = -250µA |
-1.2 |
-1.8 |
-2.5 |
V |
| Static Drain-Source On-Resistance |
R_DS(on) |
V_GS = -10V, I_D = -7.0A |
— |
37 |
50 |
mΩ |
|
|
V_GS = -4.5V, I_D = -5.0A |
— |
50 |
65 |
mΩ |
| Forward Transconductance |
g_fs |
V_DS = -5.0V, I_D = -7.0A |
— |
17 |
— |
S |
| Diodes Forward Voltage |
V_SD |
I_S = -2.0A, V_GS = 0V |
— |
-0.7 |
-1.2 |
V |
Dynamic Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Input Capacitance |
C_iss |
V_DS = -30V, V_GS = 0V, f = 1MHz |
— |
668 |
868 |
pF |
| Output Capacitance |
C_oss |
|
— |
222 |
289 |
pF |
| Reverse Transfer Capacitance |
C_rss |
|
— |
12 |
24 |
pF |
| Gate Resistance |
R_g |
V_GS = 0V, V_DS = 0V, f = 1MHz |
— |
8.6 |
— |
Ω |
Switching Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Turn-On Delay Time |
t_d(on) |
V_GS = -10V, V_DS = -30V |
— |
5.5 |
— |
ns |
| Rise Time |
t_r |
I_D = -7.0A, R_GEN = 3.0Ω |
— |
3.6 |
— |
ns |
| Turn-Off Delay Time |
t_d(off) |
|
— |
21 |
— |
ns |
| Fall Time |
t_f |
|
— |
9.1 |
— |
ns |
Gate Charge Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Total Gate Charge (V_GS = -10V) |
Q_g |
V_DS = -30V, I_D = -7.0A |
— |
11.8 |
16.0 |
nC |
| Total Gate Charge (V_GS = -4.5V) |
Q_g |
|
— |
5.3 |
6.9 |
nC |
| Gate-Source Charge |
Q_gs |
V_GS = -10V |
— |
1.8 |
2.7 |
nC |
| Gate-Drain Charge |
Q_gd |
|
— |
1.6 |
2.4 |
nC |
| Gate Plateau Voltage |
V_plateau |
|
— |
-2.9 |
— |
V |
Drain-Source Diode Characteristics ^(7)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Unit |
| Body Diode Reverse Recovery Time |
t_rr |
I_S = -7.0A, di/dt = 100A/µs |
— |
25 |
— |
ns |
| Body Diode Reverse Recovery Charge |
Q_rr |
T_J = 25°C |
— |
18 |
— |
nC |
| Diode Forward Current |
I_S |
T_C = 25°C |
— |
— |
-25 |
A |
Notes:
- This current is chip limited, which is calculated based on RθJC.
- This current is calculated on single pulse with 10µs Pulse.
- Defined by design, not subject to production test.
- Device mounted on FR-4 substrate PC board with 2oz copper in 1inch square cooling area.
- Thermal resistance from junction to the exposed pad.
- Short duration pulse test used to minimize self-heating effect.
- Defined by design, not subject to production.
